Datasheet > HGD065NE4A

HGD065NE4A

更新时间： 2024-03-03 10:10:27

品牌	Logo	应用领域
华润微 - CRMICRO		/
页数	文件大小	规格书
10页	791K
描述
TO-252(或DPAK)

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HGD065NE4A 数据手册

HGD065NE4A

○

The name and content of poisonous and harmful material in products

Hazardous Substance

≤

Cr(VI)

PBB

PBDE

DIBP

DEHP

DBP

BBP

Limit

≤0.1% ≤0.1%

≤0.1% ≤0.1% ≤0.1% ≤0.1% ≤0.1% ≤0.1% ≤0.1%

0.01%

○

Lead Frame

Molding

Chip

○

Wire Bonding

Solder

○

○：Means the hazardous material is under the criterion of 2011/65/EU.

×：Means the hazardous material exceeds the criterion of 2011/65/EU.

Note

The plumbum element of solder exist in products presently, but within the allowed range

of Eurogroup’s RoHS.

Warnings

1. Exceeding the maximum ratings of the device in performance may cause damage to the device,

even the permanent failure, which may affect the dependability of the machine. It is suggested

to be used under 80 percent of the maximum ratings of the device.

2. When installing the heatsink, please pay attention to the torsional moment and the smoothness

of the heatsink.

3. VDMOSFETs is the device which is sensitive to the static electricity, it is necessary to protect

the device from being damaged by the static electricity when using it.

4. This publication is made by Huajing Microelectronics and subject to regular change without

notice.

WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD.

Add： No.14 Liangxi RD. Wuxi, Jiangsu, China Mail:214061

http://www. crhj.com.cn

UTH

Tel: +86 0510-85807228 Fax: +86- 0510-85800864

Marketing Part：

Post：214061

Tel： +86 0510-81805277/81805336

Fax: +86 0510-85800360/85803016

Application and Service：Post：214061 Tel / Fax：+86- 0510-81805243/81805110

WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD.

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