(0.25 in) . With this option, there
is flexibility of positioning the
module to fit the specific need of
the enclosure design. (See Figure 8 compatible with industry-standard
for the mechanical drawing
dimensions of this shield.)
Recommended Solder and Wash
Process
The HFBR/HFCT-5208M is
Regulatory Compliance
These transceiver products are
intended to enable commercial
system designers to develop
equipment that complies with the
various regulations governing
certification of Information
Technology Equipment. See the
Regulatory Compliance Table
for details. Additional information
is available from your Agilent
sales representative.
wave or hand solder processes.
HFBR-5000 Process Plug
The HFBR/HFCT-5208M
The second shielded option,
option FM, is for applications that transceiver is supplied with a
are designed to have a flush
mounting of the module with
respect to the front of the panel or with the Duplex SC connector
enclosure. The flush-mount design receptacle. This process plug
process plug, the HFBR-5000, for
protection of the optical ports
accommodates a large variety of
panel thickness, i.e. 1.02 mm
(.04 in) min to 2.54 mm (0.1 in)
max. Note the reference plane for
the flush-mount design is the
interior side of the panel or
enclosure. The recommended
distance from the centerline of the 110 lb/in .
transceiver front solder posts to
the inside wall of the panel is
13.82 mm (0.544 in) . This option
contacts the inside panel or
enclosure wall on all four sides of
this metal shield. (See Figure 10
for the mechanical drawing
dimensions of this shield.)
prevents contamination during
wave solder and aqueous rinse as
well as during handling, shipping
or storage. It is made of high-
temperature, molded, sealing
material that will withstand
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage is
important.
The first case is during handling of
the transceiver prior to mounting it
on the circuit board. It is important
to use normal ESD handling
precautions for ESD sensitive
devices. These precautions
include using grounded wrist
straps, work benches, and floor
mats in ESD controlled areas, etc.
+85°C and a rinse pressure of
2
Recommended Solder Fluxes and
Cleaning/Degreasing Chemicals
Solder fluxes used with the
HFBR/HFCT-5208M fiber-optic
transceiver should be water-
soluble, organic solder fluxes.
Some recommended solder fluxes
are Lonco 3355-11 from London
Chemical West, Inc. of Burbank,
CA, and 100 Flux from Alpha-
metals of Jersey City, NJ or
equivalent fluxes from other
companies.
The second case to consider is
static discharges to the exterior of
the equipment chassis containing
the transceiver parts. To the
extent that the duplex SC
connector receptacle is exposed
to the outside of the equipment
chassis, it may be subject to
whatever ESD system level test
criteria that the equipment is
intended to meet.
Both shielded design options
connect only to the equipment
chassis and not to the signal or
logic ground of the circuit board
within the equipment closure. The
front panel aperture dimensions
are recommended in Figures 9
Recommended cleaning and
and 11. When layout of the printed degreasing chemicals for the
circuit board is done to
HFBR/HFCT-5208M are alcohols
(methyl, isopropyl, isobutyl),
aliphatics (hexane, heptane) and
other chemicals, such as soap
solution or naphtha. Do not use
partially halogenated
incorporate these metal-shielded
transceivers, keep the area on the
printed circuit board directly
under the external metal shield
free of any components and
circuit board traces. For
additional EMI performance
advantage, use duplex SC fiber-
optic connectors that have low
metal content inside the
connector. This lowers the ability
of the metal fiber-optic
connectors to couple EMI out
through the aperture of the panel
or enclosure.
Electromagnetic Interference (EMI)
Most equipment designs utilizing
these high-speed transceivers
from Agilent will be required to
meet the requirements of FCC in
the United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan.
hydrocarbons for cleaning/
degreasing. Examples of
chemicals to avoid are 1,1.1
trichloroethane, ketones (such as
MEK), acetone, chloroform, ethyl
acetate, methylene dichloride,
phenol, methylene chloride or
N methylpyrolldone.
The HFBR/HFCT-5208M EMI has
been characterized with a chassis
enclosure to demonstrate the
robustness of the parts.
Performance of a system
containing these transceivers will
vary depending on the individual
chassis design.
7
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