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HFBR-24E2K PDF预览

HFBR-24E2K

更新时间: 2023-01-03 08:39:22
品牌 Logo 应用领域
安捷伦 - AGILENT /
页数 文件大小 规格书
30页 389K
描述
Receiver, 175Mbps, SC Connector, DIP, Panel Mount

HFBR-24E2K 数据手册

 浏览型号HFBR-24E2K的Datasheet PDF文件第23页浏览型号HFBR-24E2K的Datasheet PDF文件第24页浏览型号HFBR-24E2K的Datasheet PDF文件第25页浏览型号HFBR-24E2K的Datasheet PDF文件第27页浏览型号HFBR-24E2K的Datasheet PDF文件第28页浏览型号HFBR-24E2K的Datasheet PDF文件第29页 
26  
Absolute Maximum Ratings  
Parameter  
Storage Temperature  
Operating Temperature  
Symbol  
Min.  
-55  
-40  
Max.  
+85  
+85  
+260  
10  
Units  
°C  
°C  
°C  
s
Reference  
T
S
T
A
Lead Soldering Cycle  
Temp.  
Time  
Note 1  
Supply Voltage  
Output Current  
Signal Pin Voltage  
V
I
V
SIG  
-0.5  
-0.5  
6.0  
25  
V
CC  
V
mA  
V
CC  
O
Electrical/Optical Characteristics -40°C to +85°C; 4.75 V Supply Voltage 5.25 V,  
= 511 , Fiber sizes with core diameter 100 µm, and N.A. -0.35 unless otherwise specified  
R
LOAD  
[2]  
Parameter  
Symbol Min. Typ.  
Max. Units  
Conditions  
Reference  
Responsivity  
R
5.3  
7
9.6 mV/µW T = 25°C  
@ 820 nm, 50 MHz  
11.5 mV/µW @ 820 nm, 50 MHz  
Note 3, 4  
Figure 16  
P
A
4.5  
RMS Output Noise  
Voltage  
V
NO  
0.40  
0.59  
mV  
Bandwidth Filtered  
@ 75 MHz  
Note 5  
P = 0 µW  
R
0.70  
mV  
Unfiltered Bandwidth Figure 13  
P = 0 µW  
R
Equivalent Input  
Optical Noise Power  
(RMS)  
P
N
Bandwidth Filtered  
@ 75 MHz  
-41.4  
0.065  
-43.0  
0.050  
dBm  
µW  
Optical Input Power  
(Overdrive)  
P
R
-7.6 dBm pk T = 25°C  
Figure 14  
Note 6  
A
175  
µW pk  
-8.2 dBm pk  
150  
µW pk  
Output Impedance  
Z
30  
Test Frequency =  
50 MHz  
o
dc Output Voltage  
Power Supply Current  
Equivalent N.A.  
V
I
NA  
-4.2  
-3.1  
9
0.35  
324  
-2.4  
15  
V
mA  
P = 0 µW  
R
o dc  
R
= 510 Ω  
LOAD  
EE  
Equivalent Diameter  
D
µm  
Note 7  
CAUTION: The small junction sizes inherent to the design of these components increase the components’  
susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be  
taken in handling and assembly of these components to prevent damage and/or degradation which may be  
induced by ESD.  

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