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HF05D060ACE PDF预览

HF05D060ACE

更新时间: 2024-09-25 20:42:35
品牌 Logo 应用领域
威世 - VISHAY 功效二极管
页数 文件大小 规格书
3页 119K
描述
Rectifier Diode, 1 Phase, 1 Element, 5A, 600V V(RRM), Silicon, 150 MM, WAFER

HF05D060ACE 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:WAFER包装说明:S-XUUC-N1
针数:1Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.40
风险等级:5.66应用:EFFICIENCY
外壳连接:CATHODE配置:SINGLE
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
最大正向电压 (VF):1.05 VJESD-30 代码:S-XUUC-N1
湿度敏感等级:1元件数量:1
相数:1端子数量:1
最大输出电流:5 A封装主体材料:UNSPECIFIED
封装形状:SQUARE封装形式:UNCASED CHIP
峰值回流温度(摄氏度):225认证状态:Not Qualified
最大重复峰值反向电压:600 V子类别:Rectifier Diodes
表面贴装:YES端子形式:NO LEAD
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

HF05D060ACE 数据手册

 浏览型号HF05D060ACE的Datasheet PDF文件第2页浏览型号HF05D060ACE的Datasheet PDF文件第3页 
PD - 94412A  
HF05D060ACE  
Hexfred Die in Wafer Form  
Features  
600V  
• GEN3 Hexfred Technology  
• Low VF  
IF(nom)=5A  
• Low IRR  
• Low tRR  
V
F(typ)= 1.15V @ IF(nom) @ 25°C  
• Soft Reverse Recovery  
Motor Control Antiparallel Diode  
150mm Wafer  
Benefits  
• Benchmark Efficiency for Motor Control Applications  
• Rugged Transient Performance  
• Low EMI  
Reference Standard IR Package Part: IRGS10B60KD  
• Excellent Current Sharing in Parallel Operation  
• Qualified for Industrial Market  
Electrical Characteristics (Wafer Form)  
Parameter  
Description  
Guaranteed (min, max)  
Test Conditions  
VF  
Forward Voltage Drop  
0.8V min, 1.05V max  
600V min  
IC = 1A, TJ = 25°C  
BVR  
IRM  
Reverse Breakdown Voltage  
Reverse Leakage Current  
TJ = 25°C, IR = 1mA  
TJ = 25°C, VR = 600V  
10µA max  
Mechanical Data  
Nominal Backmetal Composition, (Thickness)  
Nominal Front Metal Composition, (Thickness)  
Dimensions  
Cr (0.1µm)- NiV (0.2µm) - Ag (0.25µm)  
99% Al/1% Si, (3µm)  
0.075'' x 0.076"  
Wafer Diameter  
150mm, with std. < 100 > flat  
376µm, +/-15µm  
Wafer Thickness, Tolerance  
Relevant Die Mechanical Dwg. Number  
Minimum Street Width  
01-5507  
125µm  
Reject Ink Dot Size  
0.25mm diameter minimum  
Consistent throughout same wafer lot  
Store in original container, in dessicated  
nitrogen, with no contamination  
For optimum electrical results, die attach  
temperature should not exceed 300°C  
Ink Dot Location  
Recommended Storage Environment  
Recommended Die Attach Conditions  
Die Outline  
07/01/04  
Document Number: 93785  
www.vishay.com  
1

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