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HDB-M4-080M295V PDF预览

HDB-M4-080M295V

更新时间： 2024-01-02 03:24:57
品牌 Logo 应用领域
安费诺 - AMPHENOL 连接器
页数 文件大小 规格书
5页 791K
描述
Board Connector, 80 Contact(s), 4 Row(s), Female, Straight, Solder Terminal, ROHS COMPLIANT

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HDB-M4-080M295V 技术参数

是否Rohs认证：符合生命周期：Active
包装说明：ROHS COMPLIANTReach Compliance Code：unknown
ECCN代码：EAR99HTS代码：8536.69.40.40
风险等级：5.4Is Samacsys：N
其他特性：POLARIZED连接器类型：BOARD CONNECTOR
联系完成配合：NOT SPECIFIED联系完成终止：Matte Tin (Sn) - with Nickel (Ni) barrier
触点性别：FEMALE触点材料：BRASS
DIN 符合性：NO滤波功能：NO
IEC 符合性：NOJESD-609代码：e3
MIL 符合性：NO混合触点：NO
安装方式：STRAIGHT安装类型：BOARD
装载的行数：4选件：GENERAL PURPOSE
端子节距：0.07 mm端接类型：SOLDER
触点总数：80Base Number Matches：1

HDB-M4-080M295V 数据手册

 浏览型号HDB-M4-080M295V的Datasheet PDF文件第2页浏览型号HDB-M4-080M295V的Datasheet PDF文件第3页浏览型号HDB-M4-080M295V的Datasheet PDF文件第4页浏览型号HDB-M4-080M295V的Datasheet PDF文件第5页 
Product Data Sheet  
Amphenol® HDB3 Series High Density  
Mother Board & Daughter Board Connectors  
No. 201-3  
Rectangular Interconnects with  
.070” X .060” Grid Spacing  
HDB 3 Mother Board  
Connector  
This new connector series incorporates a higher  
density contact pattern and lower mated height  
than Amphenol’s original Low Mating Force rectan-  
gular connectors while utilizing the same durable  
and reliable B3 contact.  
The B3 brush (bristle brush bunch) contact is  
comprised of multiple strands of high tensile wire  
that intermesh to create an electrical connection.  
HDB 3 Daughter Board  
Connector  
HDB3 CONNECTOR PERFORMANCE  
BENEFITS OF THE BRUSH CONTACT  
• Redundant current paths: 14-70 gas tight points  
of contact per mated bunch  
Durability:  
100,000 mating cycles  
Insertion/Extraction Force: 1.5 ounce typical per contact  
Operating Temperature:  
Current Rating:  
-65° to 150°C  
• Very smooth low friction interface  
2 amperes  
• Low mating forces: 1.5 oz. typical per contact,  
70-90% lower than conventional contacts  
• Long contact life: 100,000 cycles of mating and  
unmating without performance degradation  
• Documented intermittency free performance: No  
10 nano-second discontinuities during  
Hot swap 1 ampere maximum  
(load dependent)  
Insulation Resistance:  
5 gigaohms minimum  
Dielectric Withstanding  
Voltage:  
750 volts, 60 hertz, rms @ Sea  
Level 250 volts, 60 hertz,  
50,000,000 cycles of 0.010” displacement  
• Impervious to fretting  
rms @ 70,000 feet Elevation  
• Contact interface meets M55302/166 thru /171  
Solderability:  
Salt Fog:  
MIL-STD-202, Method 208  
48 Hours IAW MIL-STD-1344,  
method 1001, test condition B  
HDB3 FEATURES  
Humidity:  
Vibration:  
IAW MIL-STD-1344, method  
1002, type II  
Polarization:  
Keying:  
“D” shaped design  
4 hours in each of 3 mutually  
perpendicular axes IAW MIL-ST  
1344, method 2005,  
Optional keys offer 36 unique  
keying combinations  
Guide Pins  
Optional guide pins provide  
additional alignment  
test condition V, letter H  
Shock:  
1 shock along each of three  
mutually perpendicular axes IAW  
MIL-STD-1344, method 2004,  
test condition G  
Radial Misalignment:  
Capable of correcting up to a  
.020" initial radial misalign-  
ment  
Angular Misalignment: Capable of mating with up to a  
2° initial angular misalignment  
Data Rate:  
Capable of 3.125 Gbps (consult  
Amphenol for arrangement)  
@2009 Amphenol Corporation  
Printed in U.S.A.  
1/8/2009  
Amphenol  
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