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HD6433823R PDF预览

HD6433823R

更新时间: 2024-01-27 13:16:30
品牌 Logo 应用领域
瑞萨 - RENESAS 电子
页数 文件大小 规格书
663页 5652K
描述
Renesas 8-Bit Single-Chip Microcomputer H8 Family/H8/300L Super Low Power Series

HD6433823R 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Contact Manufacturer零件包装代码:QFP
包装说明:TQFP-80针数:80
Reach Compliance Code:unknownHTS代码:8542.31.00.01
风险等级:5.44具有ADC:YES
其他特性:ALSO OPERATES AT 1.8V MINIMUM SUPPLY地址总线宽度:
位大小:8最大时钟频率:6 MHz
DAC 通道:NODMA 通道:NO
外部数据总线宽度:JESD-30 代码:S-PQFP-G80
JESD-609代码:e0长度:12 mm
I/O 线路数量:64端子数量:80
最高工作温度:75 °C最低工作温度:-20 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:TFQFP封装形状:SQUARE
封装形式:FLATPACK, THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not QualifiedROM可编程性:MROM
座面最大高度:1.2 mm速度:3 MHz
最大供电电压:5.5 V最小供电电压:4.5 V
标称供电电压:5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL EXTENDED
端子面层:TIN LEAD端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:12 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLERBase Number Matches:1

HD6433823R 数据手册

 浏览型号HD6433823R的Datasheet PDF文件第1页浏览型号HD6433823R的Datasheet PDF文件第3页浏览型号HD6433823R的Datasheet PDF文件第4页浏览型号HD6433823R的Datasheet PDF文件第5页浏览型号HD6433823R的Datasheet PDF文件第6页浏览型号HD6433823R的Datasheet PDF文件第7页 
Keep safety first in your circuit designs!  
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and  
more reliable, but there is always the possibility that trouble may occur with them. Trouble with  
semiconductors may lead to personal injury, fire or property damage.  
Remember to give due consideration to safety when making your circuit designs, with appropriate  
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or  
(iii) prevention against any malfunction or mishap.  
Notes regarding these materials  
1. These materials are intended as a reference to assist our customers in the selection of the Renesas  
Technology Corp. product best suited to the customer's application; they do not convey any license  
under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or  
a third party.  
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-  
party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or  
circuit application examples contained in these materials.  
3. All information contained in these materials, including product data, diagrams, charts, programs and  
algorithms represents information on products at the time of publication of these materials, and are  
subject to change by Renesas Technology Corp. without notice due to product improvements or  
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or  
an authorized Renesas Technology Corp. product distributor for the latest product information  
before purchasing a product listed herein.  
The information described here may contain technical inaccuracies or typographical errors.  
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising  
from these inaccuracies or errors.  
Please also pay attention to information published by Renesas Technology Corp. by various means,  
including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).  
4. When using any or all of the information contained in these materials, including product data,  
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total  
system before making a final decision on the applicability of the information and products. Renesas  
Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the  
information contained herein.  
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or  
system that is used under circumstances in which human life is potentially at stake. Please contact  
Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when  
considering the use of a product contained herein for any specific purposes, such as apparatus or  
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.  
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in  
whole or in part these materials.  
7. If these products or technologies are subject to the Japanese export control restrictions, they must  
be exported under a license from the Japanese government and cannot be imported into a country  
other than the approved destination.  
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the  
country of destination is prohibited.  
8. Please contact Renesas Technology Corp. for further details on these materials or the products  
contained therein.  
Rev. 6.00 Aug 04, 2006 page ii of xxxiv  

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