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HADM-15-12.0-S-13-2-P PDF预览

HADM-15-12.0-S-13-2-P

更新时间: 2024-02-18 05:33:19
品牌 Logo 应用领域
申泰 - SAMTEC 连接器
页数 文件大小 规格书
1页 660K
描述
Board Stacking Connector, 195 Contact(s), 13 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT

HADM-15-12.0-S-13-2-P 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:ROHS COMPLIANT
Reach Compliance Code:compliant风险等级:5.77
连接器类型:BOARD STACKING CONNECTOR联系完成配合:GOLD (30) OVER NICKEL
联系完成终止:MATTE TIN OVER NICKEL触点性别:MALE
触点材料:COPPER ALLOYDIN 符合性:NO
滤波功能:NOIEC 符合性:NO
JESD-609代码:e3MIL 符合性:NO
插接信息:MULTIPLE MATING PARTS AVAILABLE混合触点:NO
安装方式:STRAIGHT安装类型:BOARD
装载的行数:13选件:GENERAL PURPOSE
端子节距:1.2 mm端接类型:SURFACE MOUNT
触点总数:195Base Number Matches:1

HADM-15-12.0-S-13-2-P 数据手册

  
HDAM–11–12.0–S–13–2  
F-208  
MEZZ  
HDAM–23–17.0–S–13–2  
HDAM  
HD MEZZ ELEVATED ARRAYSERIES  
Open pin field for  
Single-Ended  
or Differential Pair  
configurations  
Mates with:  
HDAF  
Intermateable with  
Molex HD Mezz  
SPECIFICATIONSi  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?HDAM  
Insulator Material:  
Black Liquid Crystal Polymer  
Contact Material:  
Copper Alloy  
Choice of  
Tin-Lead or  
Lead-Free  
®
Current Rating:  
2.3A @ 80°C ambient  
Operating Temp Range:  
-55°C to +125°C  
Plating:  
Solder Charge  
Au or Sn over  
50µ" (1,27µm) Ni  
Contact Resistance:  
19 mΩ max  
299, 195  
and 143 pins  
MATED HEIGHTS*  
Working Voltage:  
200 VAC  
HDAM  
LEAD  
HDAF LEAD STYLE  
Mated Cycles:  
100  
RoHS Compliant:  
Yes  
–08.0  
20mm  
25mm  
–18.0  
30mm  
35mm  
STYLE  
–12.0  
–17.0  
35mm Stack Height  
Rated @ -3dB Insertion Loss*  
9.0 GHz / 18.0 Gbps  
Elevated stack heights  
of 20mm, 25mm, 30mm  
and 35mm  
Single-Ended Signaling  
Differential Pair Signaling  
*Data based on simulations using Final Inch® design.  
9.0 GHz / 18.0 Gbps  
Processing:  
Max Processing Temp:  
230°C for 60 seconds, or  
260°C for 20 seconds 3x  
Lead-Free Solderable:  
Yes  
*Processing conditions will  
affect mated height.  
PLATING  
OPTION  
SOLDER  
TYPE  
OTHER  
OPTION  
NO. OF PINS  
PER ROW  
NO. OF  
ROWS  
LEAD  
STYLE  
HDAM  
–S  
= 30µ"  
(0,76µm)  
Gold on  
contact area,  
Matte Tin  
on tails and  
guide pins  
–P  
DIFFERENTIAL  
APPLICATIONS  
= Pick &  
Place Pad  
Specify  
LEAD  
STYLE  
from  
–2  
–11, –15, –23  
–13  
= Lead-Free  
Tin Alloy  
(1,20)  
.0472  
95.5% Sn/  
3.8% Ag/0.7% Cu  
Solder Charge  
chart  
(2,00)  
.0787  
(22,50)  
.886  
(5,09)  
.200  
PAIR  
ARRAY  
COUNT*  
44  
60  
92  
11x13  
15x13  
23x13  
1A  
1M  
*2:1 S:G Ratio  
LEAD  
No. of  
No. of  
(2,00)  
.0787  
ALSO  
A
Pins  
Per  
Pins  
Per  
STYLE  
AVAILABLE  
(14,41)  
.567  
(19,41)  
.764  
Row  
x
Row  
x
–12.0  
Tin-Lead Solder Charge.  
Call Samtec.  
(2,00)  
.0787  
+
(2,00)  
.0787  
+
–17.0  
(16,06)  
.632  
(11,55)  
.455  
Note: HD Mezz is a trademark  
of Molex Incorporated  
(1,20)  
.0472  
Note: Some lengths, styles  
and options are non-standard,  
non-returnable.  
A
WWW.SAMTEC.COM  

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