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GS8330DW72GC-200 PDF预览

GS8330DW72GC-200

更新时间: 2024-01-16 06:49:20
品牌 Logo 应用领域
GSI 静态存储器内存集成电路
页数 文件大小 规格书
30页 583K
描述
Standard SRAM, 512KX72, 2.25ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209

GS8330DW72GC-200 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:BGA,针数:209
Reach Compliance Code:compliantECCN代码:3A991.B.2.B
HTS代码:8542.32.00.41风险等级:5.84
最长访问时间:2.25 ns其他特性:PIPELINED ARCHITECTURE
JESD-30 代码:R-PBGA-B209JESD-609代码:e1
长度:22 mm内存密度:37748736 bit
内存集成电路类型:STANDARD SRAM内存宽度:72
湿度敏感等级:3功能数量:1
端子数量:209字数:524288 words
字数代码:512000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:512KX72封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:RECTANGULAR
封装形式:GRID ARRAY并行/串行:PARALLEL
峰值回流温度(摄氏度):260认证状态:Not Qualified
最大供电电压 (Vsup):1.95 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:TIN SILVER COPPER端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:14 mm
Base Number Matches:1

GS8330DW72GC-200 数据手册

 浏览型号GS8330DW72GC-200的Datasheet PDF文件第3页浏览型号GS8330DW72GC-200的Datasheet PDF文件第4页浏览型号GS8330DW72GC-200的Datasheet PDF文件第5页浏览型号GS8330DW72GC-200的Datasheet PDF文件第7页浏览型号GS8330DW72GC-200的Datasheet PDF文件第8页浏览型号GS8330DW72GC-200的Datasheet PDF文件第9页 
Preliminary  
GS8330DW36/72C-250/200  
Double Late Write  
Double Late Write means that Data In is required on the third rising edge of clock. Double Late Write is used to implement Pipeline  
mode NBT SRAMs.  
SigmaRAM Double Late Write with Pipelined Read  
Read  
Write  
Read  
Write  
Read  
CK  
Address  
ADV  
/E1  
A
B
C
D
E
F
/W  
DQ  
QA  
DB  
QC  
DD  
CQ  
Key  
Hi-Z  
Access  
Byte Write Control  
The Byte Write Enable inputs (Bx) determine which bytes will be written. Any combination of Byte Write Enable control pins,  
including all or none, may be activated. A Write Cycle with no Byte Write inputs active is a write abort cycle.  
Example of x36 Byte Write Truth Table  
Function  
Read  
W
H
L
Ba  
X
Bb  
X
Bc  
X
Bd  
X
Write Byte A  
Write Byte B  
Write Byte C  
Write Byte D  
Write all Bytes  
Write Abort  
L
H
L
H
H
L
H
H
H
L
L
H
H
H
L
L
H
H
L
L
H
L
L
L
L
H
H
H
H
Rev: 1.00 6/2003  
6/30  
© 2003, GSI Technology, Inc.  
Specifications cited are design targets and are subject to change without notice. For latest documentation contact your GSI representative.  

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