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GRM31CR71H475MA12 PDF预览

GRM31CR71H475MA12

更新时间: 2022-02-26 14:24:10
品牌 Logo 应用领域
村田 - MURATA /
页数 文件大小 规格书
30页 780K
描述
Chip Multilayer Ceramic Capacitors for General Purpose

GRM31CR71H475MA12 数据手册

 浏览型号GRM31CR71H475MA12的Datasheet PDF文件第1页浏览型号GRM31CR71H475MA12的Datasheet PDF文件第2页浏览型号GRM31CR71H475MA12的Datasheet PDF文件第4页浏览型号GRM31CR71H475MA12的Datasheet PDF文件第5页浏览型号GRM31CR71H475MA12的Datasheet PDF文件第6页浏览型号GRM31CR71H475MA12的Datasheet PDF文件第7页 
Item  
Adhesive Strength of  
Termination  
Specification  
Test Method (Ref. Standard:JIS C 5101, IEC60384)  
Solder the capacitor on the test substrate shown in Fig.3.  
No.  
9
No removal of the terminations or other defect should occur.  
Applied Force :  
Holding Time :  
10N  
10+/-1s  
Applied Direction :  
In parallel with the test substrate and vertical with the capacitor side  
10 Vibration  
Appearance No defects or abnormalities.  
Capacitance Within the specified initial value.  
Q or D.F. Within the specified initial value.  
Solder the capacitor on the test substrate shown in Fig.3.  
Kind of Vibration :  
Vibration Time :  
Total Amplitude :  
A simple harmonic motion 10Hz to 55Hz to 10Hz  
1min  
1.5mm  
This motion should be applied for a period of 2hours in each 3 mutually perpendicular directions(total of 6hours).  
11 Substrate  
Bending Test  
Appearance No defects or abnormalities.  
Solder the capacitor on the test substrate shown in Fig.1.  
Pressurization Method :  
Flexure:  
Shown in Fig.2.  
1mm  
Capacitance Within +/-10%  
Change  
Holding Time :  
5+/-1s  
Soldering Method :  
Reflow soldering  
12 Solderability  
95% of the terminations is to be soldered evenly and continuously. Test Method :  
Solder bath method  
Flux :  
Preheat :  
Solder :  
Test Temp. :  
Test Time :  
Solution of rosin ethanol 25(mass)%  
80to 120℃、10s to 30s  
Sn-3.0Ag-0.5Cu(Lead Free Solder)  
245+/-5℃  
2+/-0.5s  
13 Resistance  
to Soldering  
Heat  
Appearance No defects or abnormalities.  
Test Method :  
Solder :  
Solder Temp. :  
Test Time :  
Solder bath method  
Sn-3.0Ag-0.5Cu(Lead Free Solder)  
270+/-5℃  
Capacitance Within +/-7.5%  
Change  
10+/-0.5s  
Q or D.F.  
Within the specified initial value.  
Within the specified initial value.  
No defects.  
Preheat Temp. :  
Preheat Time :  
120to 150℃  
1min  
I.R.  
Perform a heat treatment at 150+0/-10°C for 1hour and then let sit for 24+/-2hours at room temperature, then measure.  
Let sit for 24+/-2hours at room temperature, then measure.  
Pre-treatment :  
Post-treatment :  
Voltage  
Proof  
14 Temperature  
Sudden  
Appearance No defects or abnormalities.  
Solder the capacitor on the test substrate shown in Fig.3.  
5 cycles  
Cycles  
:
Change  
Capacitance Within +/-7.5%  
Change  
Step  
Temperature()  
Time (min)  
30+/-3  
2 to 3  
1
2
3
4
Min.Operating Temp. +0/-3  
Reference Temp.  
Q or D.F.  
Within the specified initial value.  
Within the specified initial value.  
No defects.  
Max.Operating Temp. +3/-0  
Reference Temp.  
30+/-3  
2 to 3  
I.R.  
Voltage  
Proof  
Perform a heat treatment at 150+0/-10°C for 1hour and then let sit for 24+/-2hours at room temperature, then measure.  
Let sit for 24+/-2hours at room temperature, then measure.  
Pre-treatment :  
Post-treatment :  
GRM31CR71H475MA12-01A  

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