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GRM155R61C225KE11

更新时间: 2024-02-05 02:34:33
品牌 Logo 应用领域
EMMICRO /
页数 文件大小 规格书
67页 1285K
描述
5.0 LOW-ENERGY COMPANION OR SOC

GRM155R61C225KE11 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:, 0402
Reach Compliance Code:compliantECCN代码:EAR99
Factory Lead Time:14 weeks风险等级:1.35
Samacsys Description:Multilayer Ceramic Capacitors MLCC - SMD/SMT 0402 2.2uF 16volts X5R 10%电容:2.2 µF
电容器类型:CERAMIC CAPACITOR介电材料:CERAMIC
高度:0.5 mmJESD-609代码:e3
长度:1 mm安装特点:SURFACE MOUNT
多层:Yes负容差:10%
端子数量:2最高工作温度:85 °C
最低工作温度:-55 °C封装形状:RECTANGULAR PACKAGE
封装形式:SMT包装方法:TR, PAPER, 7 INCH
正容差:10%额定(直流)电压(URdc):16 V
尺寸代码:0402表面贴装:YES
温度特性代码:X5R温度系数:15% ppm/ °C
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形状:WRAPAROUND
宽度:0.5 mmBase Number Matches:1

GRM155R61C225KE11 数据手册

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EM9304  
Table of Contents  
List of Tables..........................................................................................................................................................................4  
List of Figures.........................................................................................................................................................................5  
1 Overview.....................................................................................................................................................................................6  
1.1 Introduction.......................................................................................................................................................................6  
1.2 Chip Architecture..............................................................................................................................................................7  
1.3 RF Description..................................................................................................................................................................8  
1.4 Power Management Description ......................................................................................................................................9  
1.5 Operating Modes............................................................................................................................................................11  
1.6 Pin Description...............................................................................................................................................................11  
1.7 GPIO Configuration........................................................................................................................................................11  
1.8 QFN Reference Schematics and External Components ................................................................................................12  
1.9 WLCSP Reference Schematics and External Components ...........................................................................................14  
1.10 Related Documents......................................................................................................................................................15  
2 Electrical Specifications..........................................................................................................................................................16  
2.1 Absolute Maximum Ratings............................................................................................................................................16  
2.2 Handling Procedures......................................................................................................................................................16  
2.3 General Operating Conditions........................................................................................................................................16  
2.4 Electrical Characteristics................................................................................................................................................17  
2.5 DC Characteristics .........................................................................................................................................................17  
2.5.1 DCDC Step-Down Configuration.........................................................................................................................17  
2.5.2 DCDC Step-Up Configuration.............................................................................................................................17  
2.5.3 DCDC Off Configuration and External DCDC Configuration...............................................................................18  
2.6 Digital Pin Characteristics ..............................................................................................................................................18  
2.6.1 GPIO Pin Characteristics....................................................................................................................................18  
2.6.2 I2C Timing .........................................................................................................................................................19  
2.6.3 SPI Timing .........................................................................................................................................................19  
2.6.4 Enable Pin Characteristics..................................................................................................................................21  
2.7 Power Management Characteristics...............................................................................................................................21  
2.7.1 Low Frequency Crystal Oscillator Specifications ................................................................................................21  
2.7.2 Timing Characteristics ........................................................................................................................................21  
2.8 RF Characteristics..........................................................................................................................................................22  
2.8.1 General RF Characteristics.................................................................................................................................22  
2.8.2 High Frequency Crystal Oscillator Specifications................................................................................................22  
2.8.3 Transmitter Characteristics.................................................................................................................................22  
2.8.4 Receiver Characteristics.....................................................................................................................................23  
3 Functional Description............................................................................................................................................................24  
3.1 Block Diagram................................................................................................................................................................24  
3.1.1 Digital Processing ...............................................................................................................................................25  
3.1.2 CPU  
.........................................................................................................................................................25  
3.1.3 Memories .........................................................................................................................................................26  
3.1.4 Peripherals .........................................................................................................................................................27  
3.1.5 Applications and Patch Loading..........................................................................................................................27  
3.1.6 Security  
.........................................................................................................................................................28  
3.2 Peripherals.....................................................................................................................................................................28  
3.2.1 I2C Master .........................................................................................................................................................28  
3.2.2 SPI Master .........................................................................................................................................................29  
3.2.3 UART  
.........................................................................................................................................................30  
3.2.4 SPI Slave .........................................................................................................................................................30  
3.2.5 GPIO  
3.2.6 Timers  
.........................................................................................................................................................32  
.........................................................................................................................................................34  
3.3 Power Management .......................................................................................................................................................34  
3.3.1 Supply Domains..................................................................................................................................................35  
3.3.2 Logic Power Domains.........................................................................................................................................35  
3.3.3 Supply Monitoring ...............................................................................................................................................36  
3.3.4 Chip Disable........................................................................................................................................................36  
3.3.5 Reset Structure...................................................................................................................................................36  
3.4 Operating Modes............................................................................................................................................................37  
3.4.1 Mode Descriptions ..............................................................................................................................................37  
3.4.2 Mode Transitions ................................................................................................................................................38  
3.5 Clock Structure...............................................................................................................................................................39  
3.5.1 LF XTAL Modes..................................................................................................................................................39  
3.5.2 LF Clock Calibration............................................................................................................................................39  
4 Ordering information...............................................................................................................................................................40  
4.1 Ordering information.......................................................................................................................................................40  
4.2 Pin List .........................................................................................................................................................................40  
4.3 QFN Package Marking ..................................................................................................................................................41  
4.4 QFN Package Information..............................................................................................................................................41  
4.5 WLCSP Package Information.........................................................................................................................................42  
3
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