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GM62501.8ST3T PDF预览

GM62501.8ST3T

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
GAMMA 稳压器
页数 文件大小 规格书
13页 348K
描述
250mA ULTRA-LOW DROPOUT POSITIVE VOLTAGE REGULATOR

GM62501.8ST3T 数据手册

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DIRECTIONS FOR USAGE  
Notes on Usage  
1. Please use this IC within the stipulated absolute maximum ratings as the IC is liable to malfunction  
outside of such parameters.  
2. There is a possibility theat, oscillation may occur as a result of the impedance present between the  
power supply and the IC's input. Where impedance is 10W or more, please use a capacitor (C )  
IN  
of at least 1µF.  
With a large output current, operations can be stabilised by increasing capacitor size (C ). If C is  
IN IN  
small and capacitor size (C ) is increased, there is a possibility of oscillation due to input impedance.  
L
In such cases, operations can be stabilised by either increasing the size of C or decreasing the size of C .  
IN L  
3. Please ensure the output current (I  
) is less than Pd ÷ (V - V  
IN  
) and does not exceed the  
OUT  
OUT  
stipulated continuous total power dissipation value (Pd) for the package.  
TEST CIRCUIT  
Circuit 1  
GM6250  
V
V
IN  
O
A
+
+
R
V
V
L
V
SS  
IN  
1µF  
(Tantalum)  
1µF  
(Tantalum)  
Circuit 2  
GM6250  
V
Open  
V
IN  
O
V
V
SS  
IN  
A
CALCULATING POWER DISSIPATION  
The GM6250 series precision linear regulators include thermal shutdown and current limit circuitry to  
protect the devices. However, high power regulators normally operate at high junction temperatures so it  
is important to calculate the power dissipation and junction temperatures accurately to be sure that you  
use and adequate heat sink.  
The thermal characteristics of an IC depend four factors:  
1. Maximum Ambient Temperature T (°C)  
A
2. Power Dissipation P (Watts)  
D
3. Maximum Junction Temperature T (°C)  
J
4. Thermal Resistance Junction to ambient R  
(°C/W)  
JA  
Q
These relationship of these four factors is expressed by equation (1): T = T + P X R  
J A D  
QJA  
Maximum ambient temperature and power dissipation are determined by the design while the maximum  
junction temperature and thermal resistance depend on the manufacturer and the package type.  
8

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