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GM6250-1.8T92BG PDF预览

GM6250-1.8T92BG

更新时间: 2024-02-16 04:49:32
品牌 Logo 应用领域
GAMMA 稳压器调节器输出元件
页数 文件大小 规格书
14页 157K
描述
300mA ULTRA LOW DROPOUT POSITIVE VOLTAGE REGULATOR

GM6250-1.8T92BG 技术参数

是否Rohs认证: 符合生命周期:Contact Manufacturer
包装说明:TO-92, 3 PINReach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.65Is Samacsys:N
最大回动电压 1:1.3 V最大输入电压:10 V
最小输入电压:2.8 VJESD-30 代码:O-XBCY-W3
JESD-609代码:e3功能数量:1
端子数量:3最大输出电流 1:0.3 A
最大输出电压 1:1.836 V最小输出电压 1:1.764 V
标称输出电压 1:1.8 V封装主体材料:UNSPECIFIED
封装代码:TO-92封装形状:ROUND
封装形式:CYLINDRICAL峰值回流温度(摄氏度):NOT SPECIFIED
调节器类型:FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR表面贴装:NO
端子面层:MATTE TIN端子形式:WIRE
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

GM6250-1.8T92BG 数据手册

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GM6250  
300mA ULTRA LOW DROPOUT  
POSITIVE VOLTAGE REGULATOR  
Application Note  
Notes on Usage  
1.  
It is recommended to operate the GM6250 series within the stipulated absolute maximum ratings  
as the IC is liable to malfunction it is operated outside the ratings.  
2.  
There is a possibility of heat or oscillation as a result of the impedance present between the  
power supply and the IC's input. Where impedance is greater 10, it is recommend to use a  
capacitor (CIN) of at least 1µF at the input terminal.  
3.  
4.  
With a large output current, operations can be stabilized by increasing capacitor size (CIN). If CIN  
is too small and capacitance of (CL) is increased, there is a possibility of oscillation due to input  
impedance. In such case, operation can be stabilized by either increasing the size of CIN or  
decreasing the size of CL.  
Please ensure the output current (IOUT) is less than Pd ÷ (VIN - VOUT) and does not exceed the  
stipulated continuous for total power dissipation value (Pd) for the package.  
CALCULATING POWER DISSIPATION  
The GM6250 series precision linear regulators include thermal shutdown and current limit circuitry to  
protect the devices. However, high power regulators normally operate at high junction temperatures so  
it is important to calculate the power dissipation and junction temperatures accurately to be sure that  
you use and adequate heat sink.  
The thermal characteristics of an IC depend four factors:  
1.  
2.  
3.  
4.  
Maximum Ambient Temperature TA  
Power Dissipation PD (Watts)  
(
)
Maximum Junction Temperature TJ  
(℃  
)
Thermal Resistance Junction to ambient RJA (/W)  
These relationship of these four factors is expressed by equation : TJ = TA + PD X RJA  
Maximum ambient temperature and power dissipation are determined by the design while the  
maximum junction temperature and thermal resistance depend on the manufacturer and the package  
type.  
9

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