Datasheet > GJM0335C1E6R3DB01

GJM0335C1E6R3DB01

更新时间： 2022-02-26 12:01:02

品牌	Logo	应用领域
村田 - MURATA		/
页数	文件大小	规格书
25页	729K
描述
Chip Monolithic Ceramic Capacitor High-Q Type for General

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Table A

Char.

Capacitance Change from Value at Reference temp. (%)

-30 -25℃

-55℃

-10℃

Max.

0.54

0.82

1.37

2.56

0.58

0.87

Min.

-0.23

-0.45

-0.90

-1.88

-0.24

-0.48

Max.

Min.

Max.

0.33

0.49

0.82

1.54

Min.

-0.14

-0.27

-0.54

-1.13

Max.

0.22

0.33

0.55

1.02

0.25

0.38

Min.

-0.09

-0.18

-0.36

-0.75

-0.11

-0.21

0.40

0.59

-0.17

-0.33

Substrate Bending test

・Test substrate

Material

: Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness :0.8mm

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ: Solder resist

(Coat with heat resistant resin for solder)

for GJM02

for GJM03/15

Land

f4.5

Dimension (mm)

Type

GJM02

GJM03

GJM15

0.2

0.3

0.4

0.56

0.9

1.5

0.23

0.3

0.5

100

ꢀ

Copper foil thickness : 0.018mm

ꢀCopper foil thickness : 0.035mm

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀFig.1

(in mm)

Kind of Solder : Sn-3.0Ag-0.5Cu

Pressurization method

・

Pressurization

speed

1.0mm/s

Pressurize

50 min.

Flexure

Capacitance meter

45 45

Fig.2

(in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)

High Temperature High Humidity(Steady) , Durability

・Test substrate

Material

: Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm or 0.8mm

Copper foil thickness : 0.035mm

Kind of Solder : Sn-3.0Ag-0.5Cu

Land Dimensions

・

Chip Capacitor

Land

Dimension (mm)

Type

GJM02

GJM03

GJM15

0.2

0.3

0.4

0.56

0.9

1.5

0.23

0.3

0.5

Solder Resist

Fig.3

JEMCGS-0004M

1 2 345 6 7...25

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