G1AFS THRU G1MFS
Thermal Characteristics (T =25℃ Unless otherwise specified
■
)
a
SYMBOL
(1)
G1AFS
G1BFS
G1DFS
G1GFS
65
G1JFS
G1KFS G1MFS
PARAMETER
UNIT
R
θJ-A
(1)
R
θJ-L
Typical Thermal resistance
20
℃/W
(1)
θJ-C
R
15
Note:
(1) Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper pad areas
Characteristics (Typical)
■
FIG.2: Forward Surge Current Capability
FIG.1: Io-TL Curve
30
24
1.0
0.8
0.6
0.4
0.2
0
8.3ms Single Half Sine Wave
JEDEC Method
18
12
6
0
0
100
80
40 60
1
2
4
6
8 10
20
50
100
150
Number of Cycles
Lead Temperature (℃)
FIG.3: Typical Forward Voltage
FIG.4: Typical Reverse Characteristics
100
1000
100
10
10
Tj=125℃
1.0
0.1
0.01
1.0
Tj=25℃
0.1
0.01
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0
20
Percent of Rated Peak Reverse Voltage (%)
40
60
80
100
Instantaneous Forward Voltage (V)
2 / 4
Yangzhou Yangjie Electronic Technology Co., Ltd.
S-S1314
Rev. 1.5, 23-Nov-21
www.21yangjie.com