Datasheet > G11777_15

G11777_15

更新时间： 2022-02-26 14:43:29

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InGaAs PIN photodiode

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G11777_15 数据手册

InGaAs PIN photodiode

G11777-003P

Surface mounted type COB (chip on board) package

The G11777-003P is a small-size near infrared detector available in a surface mount COB (chip on board) package.

Its size is drastically reduced compared to the previous metal package type (G8376-03). The spectral response covers a

range from 0.9 to 1.7 ꢀm (with peak sensitivity wavelength at 1.55 ꢀm) and delivers high sensitivity and low noise. In

addition to optical communication, other applications include analysis and measurement utilizing near infrared light.

Features

Applications

Low noise

Measurement

High sensitivity

Analysis

High-speed response

Photosensitive area: φ0.3 mm

Surface mount type

Small size COB package

Low cost

Optical light level monitor

Compatible lead-free reﬂow soldering

Structure

Parameter

Window material

Package

Symbol

Speciﬁcation

Unit

Resin

Surface mount type COB

φ0.3

Photosensitive area

Absolute maximum ratings

Parameter

Reverse voltage

Symbol

Value

Unit

Operating temperature

Storage temperature

Topr

Tstg

-25 to +80

-40 to +85

°C

Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the

product within the absolute maximum ratings.

Electrical and optical characteristics (Ta=25 °C)

Parameter

Spectral response range

Peak sensitivity wavelength

Symbol

λp

Condition

Min.

Typ.

0.9 to 1.7

1.55

Max.

Unit

μm

λ=1.3 μm

λ=λp

0.70

0.75

0.85

0.95

Photosensitivity

A/W

Dark current

Rsh

NEP

VR=5 V

0.1

500

700

0.8

MHz

Cutoff frequency

Terminal capacitance

Shunt resistance

Detectivity

VR=5 V, RL=50 Ω

VR=5 V, f=1 MHz

VR=10 mV

λ=λp

300

100

MΩ

1 × 10¹²

5 × 10¹²

5 × 10^-15

cm·Hz^1/2

Noise equivalent power

λ=λp

2 × 10^-14

W/Hz^1/2

The G11777-003P may be damaged by electrostatic discharge. Be carefull when using the G11777-003P.

www.hamamatsu.com

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