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FTF3020-M/EG PDF预览

FTF3020-M/EG

更新时间: 2024-02-29 12:49:32
品牌 Logo 应用领域
恩智浦 - NXP 传感器换能器图像传感器
页数 文件大小 规格书
16页 225K
描述
Full Frame CCD Image Sensor

FTF3020-M/EG 技术参数

是否Rohs认证: 符合生命周期:Contact Manufacturer
Reach Compliance Code:unknown风险等级:5.61
水平像素:3120安装特点:THROUGH HOLE MOUNT
最高工作温度:60 °C最低工作温度:-40 °C
像素大小:12X12 µm子类别:CCD Image Sensors
表面贴装:NO垂直像素:2060
Base Number Matches:1

FTF3020-M/EG 数据手册

 浏览型号FTF3020-M/EG的Datasheet PDF文件第10页浏览型号FTF3020-M/EG的Datasheet PDF文件第11页浏览型号FTF3020-M/EG的Datasheet PDF文件第12页浏览型号FTF3020-M/EG的Datasheet PDF文件第13页浏览型号FTF3020-M/EG的Datasheet PDF文件第14页浏览型号FTF3020-M/EG的Datasheet PDF文件第16页 
Philips Semiconductors  
Product specification  
Full Frame CCD Image Sensor  
FTF3020-M  
Package information  
Top cover glass to top chip 2.4 ±0.25  
Chip - bottom package 1.7 ±0.15  
Chip - cover glass 1.3 ±0.20  
Cover glass 1.0 ±0.05  
SENSOR CRYSTAL  
EPOXY GLUE  
COVER GLASS  
Image sensor chip  
A
1.4 /100  
TOP VIEW  
INDEX  
MARK  
PIN1  
26.35±0.15  
COVER GLASS  
52.7 0.53  
±
(2.54)  
STAND-OFF PIN  
0.46 0.05  
±
A is the center of the image area.  
Position of A:  
26.35 ± 0.15 to left edge of package  
20.00 ± 0.15 to upper edge of package  
1.7 ± 0.15 to bottom of package  
Angle of rotation: less than ± 1°  
Sensor flatness: < 20 µm (P-V)  
BOTTOM VIEW  
Cover glass: Corning 7059  
Thickness of cover glass: 1 ± 0.05  
Refractive index: nd = 1.53  
Double sided AR coating < 1% (430-660 nm) reflection  
All drawing units are in mm  
48.26 0.27  
±
Figure 13 - Mechanical drawing of the PGA package of the FTF3020-M  
1999 November  
15  

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