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FDMF6707B PDF预览

FDMF6707B

更新时间: 2024-01-10 19:52:08
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 服务器主板节能技术
页数 文件大小 规格书
18页 1493K
描述
Extra-Small, High-Performance, High- Frequency DrMOS Module

FDMF6707B 数据手册

 浏览型号FDMF6707B的Datasheet PDF文件第12页浏览型号FDMF6707B的Datasheet PDF文件第13页浏览型号FDMF6707B的Datasheet PDF文件第14页浏览型号FDMF6707B的Datasheet PDF文件第15页浏览型号FDMF6707B的Datasheet PDF文件第16页浏览型号FDMF6707B的Datasheet PDF文件第18页 
Physical Dimensions  
B
PIN#1  
0.10 C  
2X  
INDICATOR  
6.00  
5.80  
4.50  
A
30  
21  
31  
20  
11  
6.00  
2.50  
1.60  
0.40  
0.65  
0.25  
0.10 C  
40  
2X  
1
0.50 TYP  
10  
TOP VIEW  
0.60  
0.35  
SEE  
DETAIL 'A'  
0.15  
2.10  
2.10  
LAND PATTERN  
RECOMMENDATION  
FRONT VIEW  
4.40±0.10  
(2.20)  
0.10  
0.05  
C A B  
C
0.30  
0.40  
(40X)  
0.20  
31  
21  
30  
20  
(0.70)  
0.50  
2.40±0.10  
0.20  
PIN #1 INDICATOR  
0.50  
1.50±0.10  
40  
(40X)  
0.30  
11  
10  
1
0.40  
2.00±0.10  
0.50  
(0.20)  
2.00±0.10  
(0.20)  
NOTES: UNLESS OTHERWISE SPECIFIED  
BOTTOM VIEW  
A) DOES NOT FULLY CONFORM TO JEDEC  
REGISTRATION MO-220, DATED  
MAY/2005.  
B) ALL DIMENSIONS ARE IN MILLIMETERS.  
C) DIMENSIONS DO NOT INCLUDE BURRS  
OR MOLD FLASH. MOLD FLASH OR  
BURRS DOES NOT EXCEED 0.10MM.  
D) DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M-1994.  
1.10  
0.90  
0.10 C  
0.08 C  
0.30  
0.20  
0.05  
0.00  
E) DRAWING FILE NAME: PQFN40AREV2  
C
SEATING  
PLANE  
DETAIL 'A'  
SCALE: 2:1  
Figure 30. 40-Lead, Clipbond PQFN DrMOS, 6.0x6.0mm Package  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the  
warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2011 Fairchild Semiconductor Corporation  
FDMF6707B • Rev. 1.0.2  
www.fairchildsemi.com  
17  

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