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FBR562ND12-W1 PDF预览

FBR562ND12-W1

更新时间: 2024-01-21 09:27:53
品牌 Logo 应用领域
富士通 - FUJITSU 光电二极管继电器
页数 文件大小 规格书
8页 232K
描述
Power/Signal Relay, POWER/SIGNAL RELAY, SPDT, MOMENTARY, 0.071A (COIL), 12VDC (COIL), 852mW (COIL), 20A (CONTACT), 14VDC (CONTACT), THROUGH HOLE-STRAIGHT MOUNT

FBR562ND12-W1 技术参数

生命周期:Not RecommendedReach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8536.41.00.05
风险等级:5.7其他特性:DUAL FUNCTION RELAY
主体宽度:20 mm主体高度:16.2 mm
主体长度或直径:26 mm最大线圈电流(直流):0.071 A
线圈工作电压(直流):9.2 V线圈功率:852 mW
线圈电阻:170 Ω最大线圈电压(直流):12 V
线圈/输入电源类型:DC最大触点电流(直流):20 A
触点(直流)最大额定R负载:20A@14VDC最大触点电压(直流):14 V
触点/输出电源类型:DC电气寿命:1000000 Cycle(s)
安装特点:THROUGH HOLE-STRAIGHT MOUNT工作时间:10 ms
最高工作温度:85 °C最低工作温度:-40 °C
包装方法:TUBE物理尺寸:26mm x 20mm x 16.2mm
继电器动作:MOMENTARY继电器功能:SPDT
继电器类型:POWER/SIGNAL RELAY释放时间:5 ms
密封:PLASTIC SEALED表面贴装:NO
端接类型:SOLDERBase Number Matches:1

FBR562ND12-W1 数据手册

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FBR562 SERIES  
RoHS Compliance and Lead Free Information  
1. General Information  
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All relays produced by Fujitsu Components are compliant with RoHS directive 2011/65/EU including  
amendments.  
Cadmium as used in electrical contacts is exempted from the RoHS directives.  
As per Annex III of directive 2011/65/EU.  
All relays are lead-free. Please refer to Lead-Free Status Info for older date codes at:  
http://www.fujitsu.com/downloads/MICRO/fcai/relays/lead-free-letter.pdf  
Lead free solder plating on relay terminals is Sn-3.0Ag-0.5Cu, unless otherwise specified.  
This material has been verified to be compatible with PbSn assembly process.  
2. Recommended Lead Free Solder Condition  
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Recommended solder Sn-3.0Ag-0.5Cu.  
Flow Solder condition:  
Pre-heating:ꢀ  
Soldering:  
maximumꢀ120˚C  
dip within 5 sec. at  
260˚Cꢀsolderꢀbath  
Solder by Soldering Iron:  
Soldering Iron  
Temperature:ꢀ maximumꢀ360˚C  
Duration:  
maximum 3 sec.  
We highly recommend that you confirm your actual solder conditions  
3. Moisture Sensitivity  
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Moisture Sensitivity Level standard is not applicable to electromechanical relays, unless otherwise indicated.  
4. Tin Whiskers  
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Dipped SnAgCu solder is known as presenting a low risk to tin whisker development. No considerable length  
whisker was found by our in house test.  
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