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FAN3122TMX_F085 PDF预览

FAN3122TMX_F085

更新时间: 2024-02-17 17:38:30
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 驱动器栅极栅极驱动
页数 文件大小 规格书
21页 1617K
描述
Single 9-A High-Speed, Low-Side Gate Driver

FAN3122TMX_F085 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SOP, SOP8,.25Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.31.00.01
Factory Lead Time:1 week风险等级:5.16
高边驱动器:NO接口集成电路类型:BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 代码:R-PDSO-G8长度:5 mm
湿度敏感等级:3功能数量:1
端子数量:8最高工作温度:125 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP8,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED电源:12 V
认证状态:Not Qualified筛选级别:AEC-Q100
座面最大高度:1.75 mm子类别:MOSFET Drivers
最大压摆率:0.9 mA最大供电电压:18 V
最小供电电压:4.5 V标称供电电压:12 V
表面贴装:YES温度等级:AUTOMOTIVE
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
断开时间:0.036 µs接通时间:0.036 µs
宽度:4 mmBase Number Matches:1

FAN3122TMX_F085 数据手册

 浏览型号FAN3122TMX_F085的Datasheet PDF文件第1页浏览型号FAN3122TMX_F085的Datasheet PDF文件第3页浏览型号FAN3122TMX_F085的Datasheet PDF文件第4页浏览型号FAN3122TMX_F085的Datasheet PDF文件第5页浏览型号FAN3122TMX_F085的Datasheet PDF文件第6页浏览型号FAN3122TMX_F085的Datasheet PDF文件第7页 
Ordering Information  
Input  
Threshold  
Packing  
Method  
Quantity  
per Reel  
Part Number  
Logic  
Package  
FAN3121CMPX  
FAN3121CMX  
FAN3121CMX_F085(1)  
3x3 mm MLP-8  
SOIC-8  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
3,000  
2,500  
2,500  
3,000  
2,500  
2,500  
3,000  
2,500  
2,500  
3,000  
2,500  
2,500  
CMOS  
TTL  
Inverting  
Channels +  
Enable  
SOIC-8  
FAN3121TMPX  
3x3 mm MLP-8  
SOIC-8  
FAN3121TMX  
FAN3121TMX_F085 (1)  
SOIC-8  
FAN3122CMPX  
3x3 mm MLP-8  
SOIC-8  
FAN3122CMX  
FAN3122CMX_F085(1)  
CMOS  
TTL  
Non-Inverting  
Channels +  
Enable  
SOIC-8  
FAN3122TMPX  
3x3 mm MLP-8  
SOIC-8  
FAN3122TMX  
FAN3122TMX_F085(1)  
SOIC-8  
All standard Fairchild Semiconductor products are RoHS compliant and many are also “Green” or going green. Green means the  
products are RoHS compliant AND they have limits on additional substances of Chlorine, Bromine and Antimony. For additional  
information on Fairchild’s “green” Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.  
Note:  
1. Qualified to AEC-Q100.  
Package Outlines  
Figure 3. 3x3 mm MLP-8 (Top View)  
Figure 4. SOIC-8 (Top View)  
Thermal Characteristics(2)  
(3)  
(4)  
(5)  
(6)  
(7)  
Package  
Units  
°C/W  
JL  
JT  
JA  
JB  
JT  
1.2  
64  
42  
2.8  
0.7  
8-Lead 3x3 mm Molded Leadless Package (MLP)  
8-Pin Small Outline Integrated Circuit (SOIC)  
Notes:  
38  
29  
87  
41  
2.3  
°C/W  
2. Estimates derived from thermal simulation; actual values depend on the application.  
3. Theta_JL (JL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads  
(including any thermal pad) that are typically soldered to a PCB.  
4. Theta_JT (JT): Thermal resistance between the semiconductor junction and the top surface of the package,  
assuming it is held at a uniform temperature by a top-side heatsink.  
5. Theta_JA (ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking,  
and airflow. The value given is for natural convection with no heatsink, as specified in JEDEC standards  
JESD51-2, JESD51-5, and JESD51-7, as appropriate.  
6. Psi_JB (JB): Thermal characterization parameter providing correlation between semiconductor junction  
temperature and an application circuit board reference point for the thermal environment defined in Note 5. For  
the MLP-8 package, the board reference is defined as the PCB copper connected to the thermal pad and  
protruding from either end of the package. For the SOIC-8 package, the board reference is defined as the PCB  
copper adjacent to pin 6.  
7. Psi_JT (JT): Thermal characterization parameter providing correlation between the semiconductor junction  
temperature and the center of the top of the package for the thermal environment defined in Note 5.  
© 2008 Fairchild Semiconductor Corporation  
FAN3121 / FAN3122 • Rev. 1.0.2  
www.fairchildsemi.com  
2

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