是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 包装说明: | CHIP |
Reach Compliance Code: | compliant | Factory Lead Time: | 12 weeks |
风险等级: | 1.53 | 构造: | Chip |
元件功耗: | 0.063 W | 第一元件电阻: | 470 Ω |
JESD-609代码: | e3 | 安装特点: | SURFACE MOUNT |
网络类型: | ISOLATED | 元件数量: | 1 |
功能数量: | 4 | 端子数量: | 8 |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
封装高度: | 0.6 mm | 封装长度: | 3.2 mm |
封装形状: | RECTANGULAR PACKAGE | 封装形式: | SMT |
封装宽度: | 1.6 mm | 包装方法: | TR, PUNCHED, 7 INCH |
额定功率耗散 (P): | 0.063 W | 额定温度: | 70 °C |
参考标准: | IEC60115-9 | 电阻: | 470 Ω |
电阻器类型: | ARRAY/NETWORK RESISTOR | 尺寸代码: | 1206 |
子类别: | ARRAY/NETWORK RESISTOR | 表面贴装: | YES |
技术: | METAL GLAZE/THICK FILM | 温度系数: | 200 ppm/ °C |
端子面层: | Matte Tin (Sn) - with Nickel (Ni) barrier | 端子形状: | WRAPAROUND |
容差: | 5% | 工作电压: | 50 V |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
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