Datasheet > ESD129-B1-CSP01005E63_15

ESD129-B1-CSP01005E63_15

更新时间： 2024-10-04 01:20:19

品牌	Logo	应用领域
英飞凌 - INFINEON		/
页数	文件大小	规格书
1页	31K
描述
Material Content Data Sheet

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ESD129-B1-CSP01005E63_15 数据手册

Material Content Data Sheet

Sales Product Name ESD129-B1-CSP01005 E63

Issued

7. September 2015

MA#

MA001346974

SG-WLL-2-2

Package

Weight*

0.04 mg

Average

Mass

[%]

Average

CAS#

Weight

[mg]

Sum

[%]

Sum

Construction Element

Material Group

Substances

Mass

[ppm]

if applicable

[ppm]

chip

pad

inorganic material

noble metal

silicon

7440-21-3

7723-14-0

7440-57-5

7440-05-3

7440-02-0

0.039

0.000

0.003

92.40

0.13

0.14

0.88

6.45

92.40

923936

1339

923936

phosphorus

gold

1410

noble metal

palladium

nickel

8788

non noble metal

< 10%

7.60

64527

76064

*deviation

Sum in total: 100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.

Company

Address

Internet

Infineon Technologies AG

81726 München

www.infineon.com

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