是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | BGA, BGA256,20X20,20 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991 | HTS代码: | 8542.39.00.01 |
风险等级: | 1.35 | 其他特性: | IT CAN ALSO OPERATE AT 3.3V |
系统内可编程: | YES | JESD-30 代码: | R-PBGA-B256 |
JESD-609代码: | e1 | JTAG BST: | YES |
湿度敏感等级: | 3 | 专用输入次数: | |
I/O 线路数量: | 212 | 宏单元数: | 980 |
端子数量: | 256 | 最高工作温度: | 85 °C |
最低工作温度: | 组织: | 0 DEDICATED INPUTS, 212 I/O | |
输出函数: | MACROCELL | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA256,20X20,20 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 260 | 电源: | 1.5/3.3,2.5/3.3 V |
可编程逻辑类型: | FLASH PLD | 传播延迟: | 10 ns |
认证状态: | Not Qualified | 子类别: | Programmable Logic Devices |
最大供电电压: | 2.625 V | 最小供电电压: | 2.375 V |
标称供电电压: | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子面层: | TIN SILVER COPPER | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
EPM1270M256I3N | INTEL |
获取价格 |
Flash PLD, 6.2ns, 980-Cell, CMOS, PBGA256, LEAD FREE, MICRO, FBGA-256 | |
EPM1270M256I5N | INTEL |
获取价格 |
Flash PLD, 10ns, 980-Cell, CMOS, PBGA256, LEAD FREE, MICRO, FBGA-256 | |
EPM1270M256I5N | ALTERA |
获取价格 |
Flash PLD, 10ns, 980-Cell, CMOS, PBGA256, LEAD FREE, MICRO, FBGA-256 | |
EPM1270T100A | ALTERA |
获取价格 |
MAX II Device Family | |
EPM1270T100C | ALTERA |
获取价格 |
MAX II Device Family | |
EPM1270T100C3N | INTEL |
获取价格 |
Flash PLD, PQFP100, 16 X 16 MM, 1MM PITCH, LEAD FREE, TQFP-100 | |
EPM1270T100C4ES | INTEL |
获取价格 |
Flash PLD, PQFP100, 16 X 16 MM, 1MM PITCH, TQFP-100 | |
EPM1270T100C5ES | INTEL |
获取价格 |
Flash PLD, PQFP100, 16 X 16 MM, 1MM PITCH, TQFP-100 | |
EPM1270T100I | ALTERA |
获取价格 |
MAX II Device Family | |
EPM1270T100I3ES | INTEL |
获取价格 |
Flash PLD, PQFP100, 16 X 16 MM, 1MM PITCH, TQFP-100 |