EN2390QI
PIN
NAME
CGND
I/O
FUNCTION
68
Connect to GND plane at all times.
Not a perimeter pin. Device thermal pad to be connected to the system GND
plane for heat-sinking purposes.
77
PGND
Absolute Maximum Ratings
CAUTION: Absolute Maximum ratings are stress ratings only. Functional operation beyond the recommended operating
conditions is not implied. Stress beyond the absolute maximum ratings may impair device life. Exposure to absolute
maximum rated conditions for extended periods may affect device reliability.
PARAMETER
SYMBOL
MIN
MAX
UNITS
Voltages on : PVIN, VOUT
-0.5
15
V
Pin Voltages – AVINO, AVIN, ENABLE, POK, S_IN, S_OUT
Pin Voltages – VFB, SS, EAIN, RCLX, FADJ
PVIN Slew Rate
2.5
-0.5
0.3
6.0
2.75
3
V
V
V/ms
°C
°C
°C
V
Storage Temperature Range
TSTG
-65
150
150
260
2000
500
Maximum Operating Junction Temperature
Reflow Temp, 10 Sec, MSL3 JEDEC J-STD-020A
ESD Rating (based on Human Body Model)
ESD Rating (based on CDM)
TJ-ABS Max
V
Recommended Operating Conditions
PARAMETER
SYMBOL
MIN
MAX
UNITS
Input Voltage Range
PVIN
4.5
2.5
14
V
AVIN: Controller Supply Voltage
Output Voltage Range (Note 1)
Output Current
AVIN
VOUT
IOUT
TA
5.5
5
V
V
0.75
9
A
Operating Ambient Temperature
Operating Junction Temperature
-40
-40
+85
+125
°C
°C
TJ
Thermal Characteristics
PARAMETER
SYMBOL
TYP
UNITS
Thermal Shutdown
TSD
160
35
°C
Thermal Shutdown Hysteresis
TSDH
θJA
°C
Thermal Resistance: Junction to Ambient (0 LFM) (Note 2)
Thermal Resistance: Junction to Case (0 LFM)
15
°C/W
°C/W
1.5
θJC
Note 1: RCLX resistor value may need to be raised for VOUT > VIN – 2.5V to increase current limit threshold.
Note 2: Based on 2oz. external copper layers and proper thermal design in line with EIJ/JEDEC JESD51-7 standard for
high thermal conductivity boards.
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