EM7180SFP
1.3. Sensing axis orientations
The orientation of the module is defined by the BMX055 chip orientation on the board as shown in Fig. 3.
z
θ
x
φ
y
gravity
Fig. 3 Orientation of the module
1.4. Absolute Maximum Ratings
1.5. Handling Procedures
This device has built-in protection against high static
voltages or electric fields; however, anti-static precautions
must be taken as for any other CMOS component. Unless
otherwise specified, proper operation can only occur when
all terminal voltages are kept within the voltage range.
Unused inputs must always be tied to a defined logic
voltage level.
Parameter
Symbol
VDD
VMIN
Conditions
-0.3V to +3.6V
-0.6V
Voltage at VDD to GND
Minimum voltage at reset
Maximum voltage at reset
Storage Temperature Range
ESD HBM versus GND/VDD/
pin to pin
VMAX
3.6V
TSTG -50°C to +150°C
VESD +/-2000V
Table 2 Absolute Maximum Ratings
1.6. Operating Conditions
Stresses above these listed maximum ratings may cause
permanent damage to the device, operation cannot be
guaranteed. Exposure beyond these absolute maximum
ratings may affect device reliability or cause malfunction.
Parameter
Supply voltage
Operating Temperature
Symbol Min
Max Unit
VDD
TA
2.4
-40
3.3
V
+85
°C
Table 3 Operating conditions
1.7. Electrical Characteristics
Unless otherwise specified: VDD= 2.4V to 3.3V, TA=-40 to +85°C.
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
High Level Input Voltage
Low Level Input Voltage
High Level Output Current
Low Level Output Current
Supply current Moving (note 1)
Still (note 2)
VIH
VIL
0.7*VDD
0
VDD
0.3*VDD
-1
VDC
VDC
mA
IOH
VOH = VDD – 0.3V
VOL = 0.3V
VDD=2.4V
IOL
1
mA
IDDM
IDDST
IDDSTD
7.9
300
230
mA
VDD=2.4V
μA
Standby (note 3)
VDD=2.4V
μA
I2C Interface
Data Rate
(note 4)
Host Bus
3400
1000
400
kbits/sec
kbits/sec
kbits/sec
µF
Sensor Bus
Pass-Through
Decoupling Capacitor
Creg
0.33
0.5
1.8
(ESR <2)
Table 4 Electrical characteristics
3
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Copyright 2014, EM Microelectronic-Marin SA
7180SFP-DS Version 1.1, 10-Dec-14
420005-A01, 2.0