Fixed Inductors (Chip Inductors)
Soldering Conditions
■ Reflow soldering conditions
T3
T2
T1
t2
t1
0
Time
Pb free solder recommended temperature profile
●
Preheat
Type
Soldering
Peak Temperature
T3 T3 Limit
Time of
Reflow
T1 [°C]
t1 [s]
T2 [°C]
t2 [s]
□F
□E
□D
□C
□A
□B
150 to 180
150 to 180
150 to 180
150 to 180
150 to 180
150 to 180
60 to 120
60 to 120
60 to 120
60 to 120
60 to 120
60 to 120
230 °C
230 °C
230 °C
230 °C
230 °C
230 °C
40 max.
40 max.
40 max.
40 max.
40 max.
40 max.
250 °C, 10 s 260 °C, 10 s 2 times max.
250 °C, 10 s 260 °C, 10 s 2 times max.
245 °C, 10 s 250 °C, 10 s 2 times max.
245 °C, 10 s 250 °C, 10 s 2 times max.
245 °C, 10 s 250 °C, 10 s 2 times max.
245 °C, 10 s 250 °C, 10 s 2 times max.
■ Flow soldering conditions
Preheat: 130 to 150 °C, 60 to 180 s, Soldering: 260 °C, 5 s max.
■ Notes
● Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation
of tin-plated terminals. Even if storage conditions are within specified limits, solderability may be reduced with the
passage of time. Therefore, please control the storage conditions and try to use the product within 6 months of receipt.
● In case the product has been stored for a period longer than 6 months, use the product only after confirmation of its
solderability.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 Sep. 2012
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