Excelics
EIA/EIB1314-2P
Not recommended for new designs. Contact factory. Effective 03/2003
13.75-14.5GHz, 2W Internally Matched Power FET
·
13.75-14.5GHz BANDWIDTH AND INPUT/OUTPUT
IMPEDANCE MATCHED TO 50 OHM
·
·
·
EIA FEATURES HIGH PAE( 30% TYPICAL)
EIB FEATURES HIGH IP3(46dBm TYPICAL)
+33.5/+33.0dBm TYPICAL P1dB OUTPUT POWER FOR
EIA/EIB
·
·
9.0/8.0dB TYPICAL G1dB POWER GAIN FOR EIA/EIB
NON-HERMETIC METAL FLANGE PACKAGE
ELECTRICAL CHARACTERISTICS (Ta = 25 OC)
EIA1314-2P
TYP
EIB1314-2P
TYP
SYMBOLS
PARAMETERS/TEST CONDITIONS
UNIT
dBm
dB
MIN
MAX
MIN
MAX
Output Power at 1dB Compression f=13.75-14.5GHz
Vds=8V, Idsq=0.5 Idss(EIA), 0.6Idss(EIB)
32.5
33.5
32
33.0
P1dB
G1dB
PAE
Gain at 1dB Compression
f=13.75-14.5GHz
8
9
7
8
Vds=8V, Idsq=0.5 Idss(EIA), 0.6Idss(EIB)
Power Added Efficiency at 1dB compression
f=13.75-14.5GHz
Vds=8V, Idsq=0.5 Idss(EIA), 0.6Idss(EIB)
30
25
%
Drain Current at 1dB Compression
880
40
850
46*
mA
Id1dB
IP3
Output 3rd Order Intercept Point
f=13.75-14.5GHz
dBm
Vds=8V, Idsq=0.5 Idss(EIA), 0.6Idss(EIB)
Saturated Drain Current Vds=3V, Vgs=0V
1100
-13
1440
1500
-1.0
-15
1700
-2.5
1100
1360
700
-2.0
-15
8
1700
-3.5
mA
mS
V
Idss
Gm
Transconductance
Pinch-off Voltage
Vds=3V, Vgs=0V
Vds=3V, Ids=12mA
Vp
Drain Breakdown Voltage Igd=4.8mA
V
BVgd
Thermal Resistance (Au-Sn Eutectic Attach)
8
oC/W
Rth
*Typical –45dBc IM3 at Pout=23dBm/Tone
MAXIMUM RATINGS AT 25OC
SYMBOLS
PARAMETERS
ABSOLUTE1
CONTINUOUS2
Vds
Vgs
Ids
Drain-Source Voltage
Gate-Source Voltage
Drain Current
12V
-8V
8V
-3V
Idss
Idss
Igsf
Pin
Tch
Tstg
Pt
Forward Gate Current
Input Power
180mA
32dBm
175oC
-65/175oC
17W
30mA
@ 3dB Compression
150oC
-65/150oC
Channel Temperature
Storage Temperature
Total Power Dissipation
14.2W
Note: 1. Exceeding any of the above ratings may result in permanent damage.
2. Exceeding any of the above ratings may reduce MTTF below design goals.
Excelics Semiconductor, Inc., 310 De Guine Drive, Sunnyvale, CA 94085
Phone: (408) 737-1711 Fax: (408) 737-1868 Web Site: www.excelics.com