Ceramic Resonators, Chip Type
Ceramic Resonators, Chip Type
(3 Array Type)
Type:
EFOS
Type:
EFOB
Type:
EFOSS
Type:
EFOSM
Type:
EFOBM
Type:
EFOJM
■ Recommended Applications
● Clock generator for microprocessors
● Carrier circuit between telecommunication equipment
(Telephone to telephone, personal computer to printer)
■ Features
● Encased in a ceramic package
● High reliability against soldering heat and mechanical
stress
● Moisture-proof sealing
(See Page 175 to 176)
■ Handling Precautions
● 1.2 mm maximum (SS/SM/BM/JM),
● Designed for reflow soldering
● Flat-bottom plate for better mountings
● Simplifies oscillation circuits by reducing the number
of circuit parts
■ Packaging Specifications
See Page 169 to 177
● RoHS compliant
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
F
O
3
5
8
4
Design No.
Nominal Oscillation
Frequency
Frequency
Tolerance
Product Code
Ceramic
Type
Packaging Style
B
Bulk Pack
Built-In Capacitors
Type with 3-terminals
EFO
3584
3.58 MHz
Resonators
0
1.0 %
0.3 %
0.5 %
Embossed
Taping
E
2 to 13 MHz
13.1 to 20 MHz
S
B
1695 16.93 MHz
(Example)
3
5
1
2
3
4
5
6
7
8
9
10
11
12
E
F
O
4
0
0
4
Design No.
Nominal Oscillation
Frequency
Frequency
Tolerance
Product Code
Ceramic
Type
Packaging Style
Built-In Capacitors
Type with 3-terminals
B
Bulk Pack
EFO
4004
4.00 MHz
Resonators
0
3
5
1.0 %
0.3 %
0.5 %
Embossed
Taping
E
4 to 13 MHz
4 to 13 MHz
12 to 20 MHz
16 to 20 MHz
30 to 50 MHz
SS
SM
BM
1695 16.93 MHz
2005 20.00 MHz
4005 40.00 MHz
(Example)
JM
Frequency range
(MHz)
Frequency Temperature Characteristics
(–20 to +80 °C)
Built-in Capacitors
(Reference)
Part Number
2.00 to 8.39
8.40 to 13.0
13.1 to 20.0
4.00 to 8.39
8.40 to 13.0
4.00 to 8.39
8.40 to 13.0
12.0 to 20.0
16.0 to 20.0
30.0 to 50.0
0.2 %
1.0 %
0.5 %
0.2 %
0.3 %
0.2 %
1.0 %
0.3 %
0.5 %
0.2 %
EFOS
EFOB
33 pF
33 pF
21 pF
EFOSS
EFOSM
EFOBM
EFOJM
33 pF
18 pF
10 pF
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
01 Feb. 2009
– EC166 –