EC-48 2.5 Gbit/s External Cavity Directly
Modulated Lasers
DATA SHEET| JUNE 14, 2006
ITU Grid Channel Numbering
Channel
Wavelength
(nm)
Channel
Wavelength
(nm)
Channel
Wavelength
(nm)
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
1527.99
1528.77
1529.55
1530.33
1531.12
1531.90
1532.68
1533.47
1534.25
1535.04
1535.82
1536.61
1537.40
1538.19
1538.98
1539.77
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
1540.56
1541.35
1542.14
1542.94
1543.73
1544.53
1545.32
1546.12
1546.92
1547.72
1548.51
1549.32
1550.12
1550.92
1551.72
1552.52
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1553.33
1554.13
1554.94
1555.75
1556.56
1557.36
1558.17
1558.98
1559.79
1560.61
1561.42
1562.23
1563.05
1563.86
1564.68
1565.50
Reliability/Quality
Designed to meet qualification requirements of Telcordia (Bellcore) GR468-Core and operating reliability <500
FITs (Assumes laser die submount held at <40oC by internal thermoelectric cooler, mean forward current of
50mA, and end of life limits based on 10mA increase in Ith and 25% change in laser efficiency).
Handling and Mounting
1. The Laser should be mounted on a heat sink at least 13 x 35 mm in size with surface finish better than 1 μm
and flatness better than 25μm. It is recommended that the laser be mechanically mounted to the heat sink
using M2-3 mm (#2-56) screws. Apply torque 0.1-0.11 m*N (0.8-1 lb*in). It is also recommended to use
thermally conductive grease between the laser package and heat sink.
2. The fiber pigtail must not be subject to a bend radius below 35mm.The fiber is unable to withstand
temperatures in excess of 120 ºC without degradation. Avoid high temperature contact during soldering
6
ORTEL, A division of EMCORE