EB52W4B50N-10.625M
EB52W4 B 50 N -10.625M
Series
Nominal Frequency
3.3Vdc LVCMOS PCB SMD TCXO
10.625MHz
Operating Temperature Range
0°C to +70°C
Control Voltage
None (No Connect on Pin 1)
Frequency Stability
±5.0ppm Maximum
ELECTRICAL SPECIFICATIONS
Nominal Frequency
10.625MHz
Frequency Stability
±5.0ppm Maximum (Inclusive of Operating Temperature Range)
Frequency Stability vs. Input Voltage ±0.3ppm Maximum (±5%)
Aging at 25°C
±1ppm/Year Maximum
Frequency Stability vs. Load
Operating Temperature Range
Supply Voltage
±0.2ppm Maximum (±2pF)
0°C to +70°C
3.3Vdc ±5%
Input Current
20mA Maximum
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
90% of Vdd Minimum
10% of Vdd Maximum
10nSec Maximum (Measured at 20% to 80% of waveform)
50% ±10% (Measured at 50% of waveform)
15pF Maximum
Duty Cycle
Load Drive Capability
Output Logic Type
Control Voltage
CMOS
None (No Connect on Pin 1)
±3ppm Minimum (Top of Can)
10kHz Minimum (Measured at -3dB with a Control Voltage of 1.65Vdc)
10kOhms Typical
Internal Trim
Modulation Bandwidth
Input Impedance
Phase Noise
-70dBc at 10Hz Offset, -100dBc at 100Hz Offset, -130dBc at 1kHz Offset, -140dBc at 10kHz Offset, -
145dBc at 100kHz Offset (Typical Values Fo=19.200MHz at 25°C at Nominal Vdd and Vc)
Storage Temperature Range
-40°C to +85°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014 Condition A (Internal Crystal Only)
Gross Leak Test
Lead Integrity
MIL-STD-883, Method 1014 Condition C (Internal Crystal Only)
MIL-STD-883, Method 2004
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-202, Method 213 Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007 Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 1 of 4