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DSPIC33FJ128GP306AT-IPT PDF预览

DSPIC33FJ128GP306AT-IPT

更新时间: 2024-01-09 02:30:25
品牌 Logo 应用领域
美国微芯 - MICROCHIP 闪存静态存储器控制器
页数 文件大小 规格书
362页 2884K
描述
16-bit Digital Signal Controllers (up to 256 KB Flash and 30 KB SRAM) with Advanced Analog

DSPIC33FJ128GP306AT-IPT 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Not Recommended零件包装代码:QFP
包装说明:10 X 10 MM, 1 MM HEIGHT, PLASTIC, MS-026, TQFP-64针数:64
Reach Compliance Code:compliantECCN代码:3A991.A.2
HTS代码:8542.31.00.01Factory Lead Time:13 weeks
风险等级:5.44具有ADC:YES
地址总线宽度:位大小:16
最大时钟频率:64 MHzDAC 通道:NO
DMA 通道:YES外部数据总线宽度:
格式:FIXED POINTJESD-30 代码:S-PQFP-G64
JESD-609代码:e3长度:10 mm
湿度敏感等级:3I/O 线路数量:53
端子数量:64最高工作温度:85 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:TFQFP
封装等效代码:TQFP64,.47SQ封装形状:SQUARE
封装形式:FLATPACK, THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):260
电源:3.3 V认证状态:Not Qualified
RAM(字数):8192ROM可编程性:FLASH
座面最大高度:1.2 mm速度:32 MHz
子类别:Digital Signal Processors最大供电电压:3.6 V
最小供电电压:3 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:40
宽度:10 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER

DSPIC33FJ128GP306AT-IPT 数据手册

 浏览型号DSPIC33FJ128GP306AT-IPT的Datasheet PDF文件第2页浏览型号DSPIC33FJ128GP306AT-IPT的Datasheet PDF文件第3页浏览型号DSPIC33FJ128GP306AT-IPT的Datasheet PDF文件第4页浏览型号DSPIC33FJ128GP306AT-IPT的Datasheet PDF文件第5页浏览型号DSPIC33FJ128GP306AT-IPT的Datasheet PDF文件第6页浏览型号DSPIC33FJ128GP306AT-IPT的Datasheet PDF文件第7页 
dsPIC33FJXXXGPX06A/X08A/X10A  
16-bit Digital Signal Controllers (up to 256 KB Flash and  
30 KB SRAM) with Advanced Analog  
Operating Conditions  
Timers/Output Compare/Input Capture  
• Up to nine 16-bit timers/counters. Can pair up to  
make four 32-bit timers.  
• 3.0V to 3.6V, -40ºC to +150ºC, DC to 20 MIPS  
• 3.0V to 3.6V, -40ºC to +125ºC, DC to 40 MIPS  
• Eight Output Compare modules configurable as  
timers/counters  
Core: 16-bit dsPIC33F CPU  
• Eight Input Capture modules  
• Code-efficient (C and Assembly) architecture  
• Two 40-bit wide accumulators  
Communication Interfaces  
• Single-cycle (MAC/MPY) with dual data fetch  
• Two UART modules (10 Mbps)  
- With support for LIN 2.0 protocols and IrDA®  
• Single-cycle mixed-sign MUL plus hardware  
divide  
• Two 4-wire SPI modules (15 Mbps)  
• Up to two I2C™ modules (up to 1 Mbaud) with  
SMBus support  
Clock Management  
• ±2% internal oscillator  
• Up to two Enhanced CAN (ECAN) modules  
(1 Mbaud) with 2.0B support  
• Data Converter Interface (DCI) module with I2S  
codec support  
• Programmable PLLs and oscillator clock sources  
• Fail-Safe Clock Monitor (FSCM)  
• Independent Watchdog Timer (WDT)  
• Fast wake-up and start-up  
Input/Output  
Power Management  
• Sink/Source up to 10 mA (pin specific) for stan-  
dard VOH/VOL, up to 16 mA (pin specific) for  
non-standard VOH1  
• Low-power management modes (Sleep, Idle,  
Doze)  
• Integrated Power-on Reset and Brown-out Reset  
• 2.1 mA/MHz dynamic current (typical)  
• 50 μA IPD current (typical)  
• 5V-tolerant pins  
• Selectable open drain, pull-ups, and pull-downs  
• Up to 5 mA overvoltage clamp current  
• External interrupts on all I/O pins  
Advanced Analog Features  
• Two ADC modules:  
Qualification and Class B Support  
- Configurable as 10-bit, 1.1 Msps with four  
S&H or 12-bit, 500 ksps with one S&H  
• AEC-Q100 REVG (Grade 1 -40ºC to +125ºC)  
• AEC-Q100 REVG (Grade 0 -40ºC to +150ºC)  
• Class B Safety Library, IEC 60730  
- 18 analog inputs on 64-pin devices and up to  
32 analog inputs on 100-pin devices  
• Flexible and independent ADC trigger sources  
Debugger Development Support  
• In-circuit and in-application programming  
• Two program and two complex data breakpoints  
• IEEE 1149.2-compatible (JTAG) boundary scan  
• Trace and run-time watch  
Packages  
Type  
QFN  
TQFP  
TQFP  
TQFP  
Pin Count  
Contact Lead/Pitch  
I/O Pins  
64  
0.50  
64  
0.50  
80  
0.50  
100  
0.40  
53  
53  
69  
85  
Dimensions  
9x9x0.9  
10x10x1  
12x12x1  
14x14x1  
Note: All dimensions are in millimeters (mm) unless specified.  
2009-2012 Microchip Technology Inc.  
DS70593D-page 1  

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