Real-Time Clocks
POWER-UP/POWER-DOWN CHARACTERISTICS
(T = -40°C to +85°C) (Note 2)
A
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Recovery at Power-Up
t
(Note 9)
20
150
ms
REC
V
V
Fall Time, V
to
to
CC
PF(MAX)
t
300
0
µs
µs
F
PF(MIN)
V
V
Fall Time, V
PF(MIN)
CC
PF(MAX)
t
R
DATA RETENTION (DS17x87 ONLY)
(T = +25°C)
A
PARAMETER
SYMBOL
CONDITIONS
CONDITIONS
MIN
TYP
TYP
MAX
UNITS
Expected Data Retention
t
(Note 9)
10
Years
DR
CAPACITANCE
(T = +25°C) (Note 10)
A
PARAMETER
SYMBOL
MIN
MAX
UNITS
Capacitance on All Input Pins
Except X1
C
C
(Note 10)
(Note 10)
12
pF
IN
IO
Capacitance on IRQ, SQW, and
DQ0–DQ7 Pins
12
pF
AC TEST CONDITIONS
PARAMETER
CONDITIONS
Input Pulse Levels:
0 to 3.0V
Output Load Including Scope and Jig:
50pF + 1TTL Gate
Input and Output Timing Measurement Reference Levels:
Input Pulse Rise and Fall Times:
Input/Output: V max and V min
IL IH
5ns
WARNING: Negative undershoots below -0.3V while the part is in battery-backed mode can cause loss of
data.
Note 1: RTC modules can be successfully processed through conventional wave-soldering techniques as long as temperature
exposure to the lithium energy source contained within does not exceed +85°C. However, post-solder cleaning with water-
washing techniques is acceptable, provided that ultrasonic vibrations not used to prevent damage to the crystal.
Note 2: Limits at -40°C are guaranteed by design and not production tested.
Note 3: All voltages are referenced to ground.
Note 4: All outputs are open.
Note 5: Specified with CS = RD = WR = V , ALE, AD0–AD7 = 0.
CC
Note 6: Applies to the AD0–AD7 pins, IRQ, and SQW when each is in a high-impedance state.
Note 7: Measured with a 32.768kHz crystal attached to X1 and X2.
Note 8: Measured with a 50pF capacitance load plus 1TTL gate.
Note 9: If the oscillator is disabled in software, or if the countdown chain is in reset, t
is bypassed, and the part becomes
REC
immediately accessible.
245/DS187
Note 10: Guaranteed by design. Not production tested.
6
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