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DP83256VF PDF预览

DP83256VF

更新时间: 2024-01-28 16:14:37
品牌 Logo 应用领域
美国国家半导体 - NSC 控制器
页数 文件大小 规格书
144页 988K
描述
PLAYERa+⑩ Device (FDDI Physical Layer Controller)

DP83256VF 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:FQFP,Reach Compliance Code:unknown
HTS代码:8542.31.00.01风险等级:5.91
Is Samacsys:N地址总线宽度:
边界扫描:NO最大时钟频率:12.5 MHz
数据编码/解码方法:NRZ; NRZI-MARK最大数据传输速率:15.625 MBps
外部数据总线宽度:JESD-30 代码:S-PQFP-G100
JESD-609代码:e0长度:14 mm
低功率模式:NODMA 通道数量:
I/O 线路数量:串行 I/O 数:1
端子数量:100片上数据RAM宽度:
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:FQFP
封装形状:SQUARE封装形式:FLATPACK, FINE PITCH
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
RAM(字数):0座面最大高度:2.45 mm
最大压摆率:350 mA最大供电电压:5.25 V
最小供电电压:4.75 V标称供电电压:5 V
表面贴装:YES技术:BICMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:14 mmuPs/uCs/外围集成电路类型:SERIAL IO/COMMUNICATION CONTROLLER, FDDI
Base Number Matches:1

DP83256VF 数据手册

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PRELIMINARY  
October 1994  
DP83256/56-AP/57  
TM  
a
PLAYER  
Device (FDDI Physical Layer Controller)  
Y
Alternate PMD Interface (DP83256-AP/57) supports  
UTP twisted pair FDDI PMDs with no external clock re-  
covery or clock generation functions required  
No External Filter Components  
General Description  
The DP83256/56-AP/57 Enhanced Physical Layer Control-  
a
ler (PLAYER device) implements one complete Physical  
Y
Y
Layer (PHY) entity as defined by the Fiber Distributed Data  
Interface (FDDI) ANSI X3T9.5 standard.  
Connection Management (CMT) Support (LEM, TNE,  
PC React, CF React, Auto Scrubbing)  
Ð Ð  
Full on-chip configuration switch  
a
The PLAYER  
device integrates state of the art digital  
Y
Y
clock recovery and improved clock generation functions to  
enhance performance, eliminate external components and  
remove critical layout requirements.  
Low Power CMOS-BIPOLAR design using a single 5V  
supply  
Y
Y
Y
Full duplex operation with through parity  
Separate management interface (Control Bus)  
Selectable Parity on PHY-MAC Interface and Control  
Bus Interface  
FDDI Station Management (SMT) is aided by Link Error  
Monitoring support, Noise Event Timer (TNE) support, Op-  
tional Auto Scrubbing support, an integrated configuration  
switch and built-in functionality designed to remove all strin-  
Y
Y
Y
Y
Y
Y
Two levels of on-chip loopback  
gent response time requirements such as PC React and  
Ð
CF React.  
Ð
4B/5B encoder/decoder  
Framing logic  
Elasticity Buffer, Repeat Filter, and Smoother  
Line state detector/generator  
Features  
Y
Single chip FDDI Physical Layer (PHY) solution  
Y
Supports single attach stations, dual attach stations  
and concentrators with no external logic  
DP83256 for SAS/DAS single path stations  
DP83257 for SAS/DAS single/dual path stations  
DP83256-AP for SAS/DAS single path stations that re-  
quire the alternate PMD interface  
Integrated Digital Clock Recovery Module provides en-  
hanced tracking and greater lock acquisition range  
Y
Y
Y
Y
Integrated Clock Generation Module provides all neces-  
sary clock signals for an FDDI system from an external  
12.5 MHz reference  
TL/F/11708–1  
FIGURE 1-1. FDDI Chip Set Overview  
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.  
BMACTM, BSITM, CDDTM, CDLTM, CRDTM, CYCLONETM, MACSITM, PLAYERTM, PLAYER  
TM  
and TWISTERTM are trademarks of National Semiconductor Corporation.  
a
C
1995 National Semiconductor Corporation  
TL/F/11708  
RRD-B30M115/Printed in U. S. A.  

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