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DP83265

更新时间: 2024-01-20 07:24:43
品牌 Logo 应用领域
其他 - ETC 电信集成电路
页数 文件大小 规格书
76页 536K
描述

DP83265 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:QFP,Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.86
JESD-30 代码:S-PQFP-G160JESD-609代码:e0
长度:28 mm功能数量:1
端子数量:160封装主体材料:PLASTIC/EPOXY
封装代码:QFP封装形状:SQUARE
封装形式:FLATPACK峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified座面最大高度:3.7 mm
标称供电电压:5 V表面贴装:YES
电信集成电路类型:TELECOM CIRCUIT端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:28 mmBase Number Matches:1

DP83265 数据手册

 浏览型号DP83265的Datasheet PDF文件第2页浏览型号DP83265的Datasheet PDF文件第3页浏览型号DP83265的Datasheet PDF文件第4页浏览型号DP83265的Datasheet PDF文件第5页浏览型号DP83265的Datasheet PDF文件第6页浏览型号DP83265的Datasheet PDF文件第7页 
PRELIMINARY  
February 1991  
DP83265 BSITM Device  
(FDDI System Interface)  
General Description  
Features  
Y
32-bit wide Address/Data path with byte parity  
The DP83265 BSI device implements an interface between  
the National FDDI BMACTM device and a host system. It  
provides a multi-frame, MAC-level interface to one or more  
MAC Users.  
Y
Programmable transfer burst sizes of  
words  
4 or 8 32-bit  
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Interfaces to low-cost DRAMs or directly to system bus  
2 Output and 3 Input Channels  
The BSI device accepts MAC User requests to receive and  
transmit multiple frames (Service Data Units). On reception  
(Indicate), it receives the byte stream from the BMAC de-  
vice, packs it into 32-bit words and writes it to memory. On  
transmission (Request), it unpacks the 32-bit wide memory  
data and sends it a byte at a time to the BMAC device. The  
host software and the BSI device communicate via regis-  
ters, descriptors, and an attention/notify scheme using clus-  
tered interrupts.  
Supports Header/Info splitting  
Bridging support  
Efficient data structures  
Programmable Big or Little Endian alignment  
Full Duplex data path allows transmission to self  
Confirmation status batching services  
Receive frame filtering services  
Operates from 12.5 MHz to 25 MHz synchronously with  
host system  
TL/F/10791–1  
FIGURE 1. FDDI Chip Set Block Diagram  
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.  
BSITM, BMACTM, CDDTM, CRDTM and PLAYERTM are trademarks of National Semiconductor Corporation.  
C
1995 National Semiconductor Corporation  
TL/F/10791  
RRD-B30M105/Printed in U. S. A.  

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