DMTH63M6LPSW
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Symbol
VDSS
Value
Unit
V
60
±20
105
74
Gate-Source Voltage
V
VGSS
TC = +25°C
A
Continuous Drain Current, VGS = 10V (Note 6)
ID
TC = +100°C
Maximum Continuous Body Diode Forward Current (Note 6)
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
Pulsed Body Diode Forward Current (10μs Pulse, Duty Cycle = 1%)
Avalanche Current, L = 1mH
105
420
420
20
A
A
IS
IDM
A
I
SM
A
IAS
Avalanche Energy, L = 1mH
200
mJ
EAS
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 5)
Symbol
PD
Value
3.3
Unit
W
TA = +25°C
TC = +25°C
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
45
°C/W
W
RθJA
84.7
PD
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
1.77
°C/W
°C
RθJC
-55 to +175
TJ, TSTG
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
Symbol
Min
Typ
Max
Unit
Test Condition
60
V
1
BVDSS
IDSS
VGS = 0V, ID = 10mA
VDS = 48V, VGS = 0V
μA
nA
±100
IGSS
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
1.3
2.5
4.1
6.2
1.2
V
mΩ
V
VGS(TH)
RDS(ON)
VSD
3.2
4.6
0.8
VDS = VGS, ID = 250μA
VGS = 10V, ID = 20A
VGS = 4.5V, ID = 20A
VGS = 0V, IS = 20A
Static Drain-Source On-Resistance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
2479
863
69
Ciss
Coss
Crss
Rg
VDS = 30V, VGS = 0V,
f = 1MHz
Output Capacitance
pF
Reverse Transfer Capacitance
Gate Resistance
1.44
44.8
23
Ω
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge (VGS = 10V)
Total Gate Charge (VGS = 4.5V)
Gate-Source Charge
Qg
Qg
nC
ns
VDD = 30V, ID = 20A
7.7
Qgs
Qgd
tD(ON)
tR
Gate-Drain Charge
10.6
7.7
Turn-On Delay Time
Turn-On Rise Time
33
VDD = 30V, VGS = 10V,
ID = 20A, Rg = 3.3Ω
Turn-Off Delay Time
34.5
24.5
43.6
52.5
tD(OFF)
tF
Turn-Off Fall Time
Body Diode Reverse-Recovery Time
ns
tRR
IF = 20A, di/dt = 100A/μs
Body Diode Reverse-Recovery Charge
nC
QRR
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.
6. Thermal resistance from junction to soldering point (on the exposed drain pad).
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
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July 2023
DMTH63M6LPSW
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Document number: DS44812 Rev. 5 - 2