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DF9-09P-1V(20) PDF预览

DF9-09P-1V(20)

更新时间: 2024-02-16 14:13:08
品牌 Logo 应用领域
广濑 - HRS PC连接器
页数 文件大小 规格书
8页 232K
描述
Board Connector, 9 Contact(s), 2 Row(s), Male, Straight, 0.039 inch Pitch, Surface Mount Terminal, Locking Mech, Beige Insulator, Receptacle

DF9-09P-1V(20) 技术参数

生命周期:ActiveReach Compliance Code:unknown
风险等级:5.74其他特性:W/ METAL FITTING, TUBE PKG.
板上安装选件:PEG主体宽度:0.165 inch
主体深度:0.13 inch主体长度:0.398 inch
主体/外壳类型:RECEPTACLE连接器类型:BOARD CONNECTOR
联系完成配合:SN联系完成终止:TIN
触点性别:MALE触点材料:PHOSPHORUS-COPPER
触点模式:STAGGERED触点电阻:50 m Ω
介电耐压:250VAC V耐用性:30 Cycles
绝缘电阻:500000000 Ω绝缘体颜色:BEIGE
绝缘体材料:POLYAMIDE插接触点节距:0.039 inch
安装选项1:LOCKING MECH安装方式:STRAIGHT
安装类型:BOARD连接器数:ONE
PCB行数:2装载的行数:2
最高工作温度:85 °C最低工作温度:-45 °C
PCB接触模式:STAGGEREDPCB触点行间距:3.9116 mm
极化密钥:POLARIZED HOUSING额定电流(信号):0.5 A
参考标准:UL可靠性:COMMERCIAL
子类别:Headers and Edge Type Connectors端子长度:
端子节距:0.9906 mm端接类型:SURFACE MOUNT
触点总数:9Base Number Matches:1

DF9-09P-1V(20) 数据手册

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BPrecautions for Use  
IR reflow condition  
Preheating area 150ç for 100~120 seconds  
Soldering area 235±5ç for 10 seconds max.  
220ç Min for 10~30 second  
Temperature  
1. Recommended Temperature Profile (SMT)  
Maximum  
Preheating area  
Soldering area  
Time  
Note 1 : Maximum twice action is allowed under the same condition. However, the interval between  
the first process and second actions must be maintained at the room temperature.  
Note 2 : The temperature indicates the board surface temperature in the connector lead area.  
Soldering iron temperature: 290 10ç, Soldering time: Within 2 seconds  
0.15mm  
2. Recommended Manual Soldering Condition (SMT)  
3. Recommended Screen Thickness (SMT)  
4. Board Warp(SMT)  
Maximum 0.03mm in the connector center area, based on both connector edges.  
Refer to the "Nylon Connector Instruction Manual".  
5. Cleaning Condition  
6. Cautions  
Avoid retaining the board with the connector only, and fix the board by any other means than the connector.  
Where the board is not mounted, the insertion or extraction will cause damage or deformation in contacts.  
Excessive scoop insertion or extraction may result in damage.  
In the manual soldering process, don't carry out flux coating which will cause a flux blister on the connector.  
The color phase of this product may be slightly different from that of the forming product according to the  
manufacturing lot. However, the difference doesn't affect the performance.  
A285  

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