The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
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DF24 Series●0.9 mm Pitch Vertical Mating Board-to-Wire Connectors
■Usage recommendations and Precautions
1. Recommended
Temperature(ç)
temperature profile
250
(Including Lead-free solder)
240
220
Reflow conditions
Preheating:
200
150
100
50
190
170
180 10ç 60~20sec.
Soldering:
250ç max.
Preheating
Soldering
240çmin. 20sec. max.
220çmin. 60sec. max.
0
50
100
150
200
250
Time(S)
Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions, providing that
there is a return to normal temperature between the first and second cycle.
Note 2: The temperature profile indicates the board surface at the point of contacts with the
connector terminals.
2.Recommended manual soldering Manual soldering: 300 10ç for 3 seconds
3.Recommended screen thickness and Thickness: 0.12mm
opening area ratio (Pattern area ratio) Opening area ratio: 80%
4. Board warpage
Maximum of 0.03mm at the connector center, with both ends of the connector as reference points.
Refer to Nylon Connector Use Handbook”.
5. Cleaning conditions
6. Wire preparation and
contact crimping
“
Refer to “Nylon Connector Use Handbook”.
The crimp contacts are of a very small form and because of this, crimping should be performed carefully
based on the content of the Crimping Conditions Table and the Crimping Quality Standards Manual.
■Removal of the inserted socket contacts
7. Precautions
* Using the socket contact extraction tool (DF-C-PO(B) ) carefully lift the contact retention tab on the
insulator housing, as shown on the Fig.1 and pull-out the wire.
* Lift the tab ONLY enough to remove the contact. Exercise caution NOT to deflect too much.
* The tab should return to its original position after the contact is removed.
* The tab must be in its original position before inserting the new socket contact.
Contact extraction tool
Contact
retention tab
DF-C-PO(B)
Fig. 1. Contact Removal
B303