DIN[8:1] INPUT STRUCTURE
Refer to Figure 2. Each DINn signal is conditioned by the resistor / diode network and presented to the comparator IN+. The
reference and hysteresis voltage is developed at the comparator IN-. Notable features:
x
x
When Vdd is +12V, the circuit shall source ~0.9mA to a grounded input. This current will prevent a “dry” relay
contact.
The input threshold voltage and hysteresis with Vdd = 12V ±10%:
o
o
o
The falling Vth > 3.5V
The rising Vth < 7.5V
Hysteresis > 1.5V
x
x
The comparator includes an RC filter to provide noise rejection of transient pulses of up to several us. Thus there is a
relatively large DINx setup time of several us (Refer to timing parameter tsu2).
The inputs can withstand continuous input voltages of 40V minimum. The isolation diode breakdown voltage is
greater than 50V. The 12K Ohm input resistor is designed to limit diode breakdown current to safe levels during
transient events.
TIMING DIAGRAMS
7.5
INPUT
3.5
tHL
tHL
1.5
OUTPUT
LO
CL = 30pF
Figure 3 Input to Output Delay
3.0
3.0
OE or CE
1.5
1.5
0
0
tZL
tHZ
tLZ
tZH
HIGH Z
HIGH Z
HI
0.2
1.3
1.3
OUTPUT
0.2
LO
HIGH Z
HIGH Z
VIN = VSS
RL = 1K: to VSS
CL = 30pF
VIN = VDD
RL = 1K: to VCC
CL = 30pF
Figure 4 Chip Select or Output Enable to Output Delay
©2015 Device Engineering Inc
Page 3 of 8
DS-MW-01167-01 Rev B
02/17/2015