DAC-1025
10-Bit, 250MSPS, Low-Power D/A Converters
TECHNICAL NOTES
Humidity Susceptibility
PIN DESCRIPTIONS
Plastic mold compounds that are used to house ICs can absorb moisture.When these
devices are exposed tohumidity the plastic package can undergo slight changes that can
apply pressure to the internal die. Stresses placed on a precision data converters can cause
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environments where humidity is a concern.
PIN
PIN NAME
DESCRIPTION
1 -10 BIT 1 (MSB) through B10 (LSB) Digital Data input bits. B1 (MSB), B10 (LSB).
11, 12,
13,14
19,25
15
DGND
NC
Digital Ground
No Connection. For noise rejection may be tied
to AGND.
Control pin to power-down the DAC. Sleep = HI,
On = LO. Internal 20µA active pull-down current.
Connect to AGND to enable internal 1.24V
reference. Connect to AVDD to disable internal
reference.
Reference voltage output when using internal
1.24V reference
Input pin when supplying external reference.
Full Scale current adjustment (gain). Use resistor
to AGND to set current (see technical notes).
External capacitor to AGND helps to reduce
bandwidth.
SHTDWN
Board Mounting Considerations
For applications requiring the highest accuracy, attention should be paid to the board
mounting location of SE and SM devices.These models use a plasticTSSOP package
that could subject the die to mild stresses when the printed circuit board is cooled or
heated. Placing the device in areas subject to slight twisting may cause die stresses and
consequentlydegradation in the accuracyof the converter. It is preferred that the device
be placed in the center of the PCBor near the edge of the shortest side where stresses due
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for die stress.
16
REFSEL
17
18
REFI/O
GAINADJ
23
20
COMP
AGND
Analog Ground
Complimentary output current. Full scale is
attained when digital inputs are at all 0's.
True output current. Full scale is attained when
digital inputs are at all 1's.
Supply for analog circuitry+2.7V to +3.6V
(+3.0V to +3.6V recommended).
21
22
IOUTB
IOUTA
Board Assembly Considerations
Precision converters provide high accuracyover temperature extremes, but some PC board
assemblyprecautions are necessary. Changes in DC parameters can be expected with
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tures, this may reduce device initial accuracy.
24
26
27
AVDD
DGND
DVDD
Digital Ground
Supply for digital circuitry +2.7V to +3.6V
Rising edge of clock latchesdata into input
registers
28
CLK
GLOSSARY OF SPECIFICATIONS
DIFFERENTIAL LINEARITY ERROR:The maximum deviation of any quantum (LSB
change) in the transfer function of a data converter from its ideal size of FSR/2n.
108&3ꢁ4611-:ꢁ3&+&$5*0/ꢁ3"5*0ꢁŷ1433Ÿ: The output change in a data converter
caused by a change in power supply voltage. Power supply sensitivity is generally speci-
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DIFFERENTIAL LINEARITY TEMPCO:5IFꢀDIBOHFꢀJOꢀEJ ꢀFSFOUJBMꢀMJOFBSJUZꢀFSSPSꢀXJUIꢀ
temperature for a data converter, expressed in ppm/°C of FSR (Full Scale Range).
REFERENCE INPUT MULTIPLYING BANDWIDTH:The -3dB reduction in the output
when applying a sinusoidal voltage to the external reference (digital inputs are set to all
1s).The frequency is increased until the amplitude of the output waveform is -3dB of its
original value.
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a data converter or other circuit. It is expressed as a percent of analog magnitude.
GAIN TEMPCO:The change in gain (or scale factor) with temperature for a data con-
verter or other circuit, generally expressed in ppm/°C.
SETTLINGTIME: The time elapsed from the application of a full scale step input to a cir-
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analog multiplexers, and D/A converters.
INTEGRAL LINEARITY ERROR:The maximum deviation of a data converter transfer
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expressed in LSB's or in percent of FSR.
TOTAL HARMONIC DISTORTION:ꢁ5IFꢁSBUJPꢁPGꢁUIFꢁSNTꢁTVNꢁPGꢁUIFꢁ ꢁSTUꢁꢏꢁIBSNPOJDTꢁUPꢁUIFꢁ
rms of the fundamental signal, usually expressed in dB
INTERNAL REFERENCE VOLTAGE DRIFT:The maximum deviation from the measured
value at room temperature as compared with the value measured at eitherTmin orTmax.
GLITCH AREA:The transientappearing at the output when the input switches from
one code to another.Typically the worst case is found at the MSB code transition. It is
measured as the area under the overshoot portion of the curve and is expressed as a
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OUTPUT COMPLIANCE RANGE:The allowable MaximumVoltage at the output of a
D/A.
OFFSET ERROR:The deviation from the ideal at analog zero output
SPURIOUS FREE DYNAMIC RANGE (SFDR):The largest harmonic, spurious frequency
or noise component in a signal FFT. Itis expressed in dbwith respect tothe fundamental
frequency.
OFFSET DRIFT:The change with temperature ofanalog zero for a data converter operat-
ing in the bipolar mode. Itis generally expressed in ppm/°C of FSR.
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01 Feb 2016 MDA_DAC-1025.C01.D1 Page4 of 6
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