D Series
Heatsink For TO-252, TO-263
and TO-268 devices
OhmiteꢀDꢀSeriesꢀheatsinksꢀprovideꢀanꢀinnovativeꢀ
solutionꢀforꢀSMTꢀcompatibleꢀsemiconductorsꢀandꢀ
resistors.ꢀTheꢀuniqueꢀdesignꢀ(PatentꢀPending)ꢀcom-
binesꢀtinꢀplated,ꢀsolderableꢀrodsꢀwithꢀanꢀaluminumꢀ
extrudedꢀheatꢀsinkꢀbody.ꢀTheseꢀrodsꢀ(orꢀ“rollers”)ꢀ
areꢀmatedꢀmechanicallyꢀtoꢀtheꢀheatsinkꢀbyꢀforgingꢀtoꢀ
reduceꢀtheꢀthermalꢀresistanceꢀbetweenꢀtheꢀheatsinkꢀ
bodyꢀandꢀtheꢀsolderableꢀfeet.
ꢀꢀSpecificallyꢀdesignedꢀforꢀuseꢀwithꢀtheꢀincreasinglyꢀ
popularꢀTO-252,ꢀTO-263ꢀandꢀTO-268ꢀpackages,ꢀtheꢀ
DꢀSeriesꢀaffordsꢀtheꢀuserꢀsuperiorꢀthermalꢀperfor-
manceꢀoverꢀtheꢀmoreꢀcommonꢀstampedꢀaluminumꢀ
heatsinks.ꢀByꢀeliminatingꢀtheꢀstakingꢀjointꢀtypicallyꢀ
usedꢀinꢀstampedꢀheatsinks,ꢀtheꢀresultingꢀairꢀgapꢀandꢀ
thermalꢀ“bottle-neck”ꢀisꢀalsoꢀeliminated,ꢀwhileꢀsur-
faceꢀareaꢀforꢀcoolingꢀisꢀmaximizedꢀwithꢀtheꢀextrudedꢀ
finsꢀofꢀtheꢀDꢀSeriesꢀbody.
F ꢀ at u ꢂ ꢀ S
•ꢀIncreasedꢀsurfaceꢀareasꢀbyꢀ3ꢀtimesꢀthereforeꢀꢀther-
malꢀperformanceꢀupꢀtoꢀ300%ꢀoverꢀtheꢀaluminumꢀ
stampedꢀheatꢀsinksꢀonꢀmarkets
•ꢀLightꢀweightꢀaluminumꢀconstructionꢀallowsꢀfasterꢀ
pickꢀandꢀplaceꢀassemblyꢀreducingꢀtheꢀmanufactur-
ingꢀcycleꢀtime
•ꢀRadiusꢀmountedꢀ“Rollers”ꢀareꢀdesignedꢀforꢀmaxi-
mizingꢀheatꢀtransferꢀfromꢀtheꢀcomponentꢀandꢀ
avoidingꢀtheꢀthermalꢀ“bottle-neck”ꢀseenꢀinꢀstampedꢀ
andꢀstakedꢀheatsinks.
•ꢀAvailableꢀinꢀbulkꢀpackagingꢀorꢀtapeꢀandꢀreelꢀ(200ꢀorꢀ
250ꢀbasedꢀonꢀpartꢀseries)
•ꢀRoHSꢀCompliant
Hꢀat DꢁSSꢁpatꢁon
Air Velocity (ft./min.)
400 600 800
Air Velocity (ft./min.)
200
1000
14
200
400
600
800
1000
12
60
55
50
45
40
35
30
25
50
45
40
35
30
25
TO-252 (D)
TO-263 (D2)
TO-268 (D3)
10
8
101 & 201
301
401
12
10
8
101 & 201
301
401
6
4
6
4
2
2
4
6
8
10
2
4
6
8
10
Heat Dissipated (watts)
Heat Dissipated (watts)
FinalꢀthermalꢀperformanceꢀisꢀhighlyꢀdependentꢀonꢀtheꢀthermalꢀcharacteristicsꢀofꢀtheꢀPCB.ꢀItꢀisꢀ
possibleꢀtoꢀseeꢀaꢀ50%ꢀdropꢀinꢀtempꢀriseꢀinꢀnaturalꢀconvectionꢀwithꢀaꢀthermallyꢀimprovedꢀPCB.
(continued)
1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com
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