THRU
05
KB
D6KB10
D6
o
GLASS PASSIVATED
BRIDGERECTIFIERS
REVERSE VOLTAGE - 100 to 1000Volts
FORWARD CURRENT - 6.0 Amperes
D3K
.130(3.3)
FEATURES
● Glass passivated chip junction
.057(1.45)
.555(14.1)
.114(2.9)
.110(2.8)
.094(2.4)
R2
.531(13.5)
● High case dielectric strength
● High surge current capability
ldeal for printed circuit board
.055(1.4)
.039(1.0)
.059(1.5)
.043(1.1)
.094(2.4)
.071(1.8)
MACHANICAL DATA
● Terminal:Plated leads solderable per MIL-STD 202E,
Method 208C
.034(0.86)
.026(0.66)
● Case:UL-94 Class V-0 recognized Flane Retardant Epoxy
.024(0.6)
.016(0.4)
.162 .162
.138 .138
(4.11)(4.11)
.162
.138
● Polarity:Polarity symbol marked on body
● Mounting position:any
(4.11)
(3.51)(3.51)(3.51)
●Lead Free Finish/RoHS Compliant
2
1
3
4
1
3
2
4
-
+
~
~
Dimensions in inches and (milimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25℃ ambient temperature unless otherwise specified.
Single phase, half wave ,60Hz, resistive or inductive load.
For capacitive load, derate current by 20%
SYMBOL D6KB01 D6KB02 D6KB04
D6KB06
600
D6KB08 D6KB10
UNIT
CHARACTERISTICS
Maximum Recurrent Peak Reverse Voltage
VRRM
VRMS
VDC
100
70
200
140
200
400
280
400
800
560
800
1000
700
V
V
V
Maximum RMS Voltage
420
Maximum DC Blocking Voltage
100
600
1000
Maximum Average Forward Rectified Output Current
@ TC=140℃ (with heatsink)
I(AV)
A
6
Peak Forward Surge Current
IFSM
VF
150
A
8.3ms Single Half Sine-Wave
Super Imposed on Rated Load (JEDEC Method)
1.0
93
55
1.5
15
Maximum Forward Voltage at 3.0A DC
V
I2t
A2s
I2t Rating for Fusing (t<8.3ms)
Maximum Typical Thermal Resistance without heatsink
RθJa
RθJC
RθJL
℃/W
with heatsink
without heatsink
10.0
500
Maximum DC Reverse Current
at Rated DC Blocking Voltage
@ Ta =25℃
IR
μA
@ Ta =125℃
-55 to +150
-55 to +150
Operating Temperature Range
Storage Temperature Range
TJ
℃
℃
TSTG
http://www.bytesonic.com.tw
Version 1.0
2015/2/2