DS1672
THERMAL INFORMATION
PACKAGE
8 DIP (300 mils)
8 SO (150 mils)
8 µSOP (3mm)
THETA-JA
THETA-JC
40°C/W
110°C/W
170°C/W
221°C/W
40°C/W
39°C/W
PACKAGE INFORMATION
For the latest package outline information, go to www.maxim-ic.com/DallasPackInfo.
DOCUMENT
PACKAGE TYPE
NUMBER
8 DIP (300 mils)
8 SO (150 mils)
8 µSOP (3mm)
56-G5005-000
56-G2008-001
56-G2018-001
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No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.
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