Datasheet > D00FCWFFJ-E2

D00FCWFFJ-E2

更新时间： 2022-02-26 11:18:01

品牌	Logo	应用领域
罗姆 - ROHM		/
页数	文件大小	规格书
42页	1565K
描述
35V Withstand Voltage 1A LDO Regulators

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D00FCWFFJ-E2 数据手册

Daattaasshheeeett

BDxxFC0 Series

●Thermal Resistance

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

HTSOP-J8

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

206.4

45.2

°C/W

Ψ_JT

TO252-5 / TO252-3

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

115.3

20.8

°C/W

Ψ_JT

(Note 1)Based on JESD51-2A(Still-Air)

(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 3)Using a PCB board based on JESD51-3.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

(Note 4)Using a PCB board based on JESD51-5, 7.

Thermal Via ^{(Note 5)}

Layer Number of

Material

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

Measurement Board

Pitch

Diameter

4 Layers

FR-4

1.20mm

Φ0.30mm

Top

Bottom

Copper Pattern

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

70μm

Footprints and Traces

70μm

74.2mm x 74.2mm

35μm

74.2mm x 74.2mm

(Note 5) This thermal via connects with the copper pattern of all layers

www.rohm.com

TSZ02201-0G2G0A600040-1-2

16.May.2016 Rev.004

9/38

TSZ22111・15・001

1...6 7 8910 11 12...42

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