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CY8C5588LTI-114 PDF预览

CY8C5588LTI-114

更新时间: 2024-02-17 20:23:26
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 时钟
页数 文件大小 规格书
102页 2766K
描述
Multifunction Peripheral, CMOS, 8 X 8 MM, 0.40 MM HEIGHT, ROHS COMPLAINT, MO-220, QFN-68

CY8C5588LTI-114 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:QFN
包装说明:8 X 8 MM, 0.40 MM HEIGHT, ROHS COMPLAINT, MO-220, QFN-68针数:68
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.84地址总线宽度:
边界扫描:YES总线兼容性:USB
最大时钟频率:80 MHz外部数据总线宽度:
JESD-30 代码:S-XQCC-N68JESD-609代码:e4
长度:8 mm湿度敏感等级:3
I/O 线路数量:48端子数量:68
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装等效代码:LCC68,.32SQ,16封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
电源:1.8/5 V认证状态:Not Qualified
RAM(字数):32768ROM大小(位):262144 Bits
座面最大高度:1 mm子类别:Other Microprocessor ICs
最大供电电压:5.5 V最小供电电压:1.71 V
标称供电电压:1.8 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:NO LEAD
端子节距:0.4 mm端子位置:QUAD
处于峰值回流温度下的最长时间:20紫外线可擦:N
宽度:8 mmBase Number Matches:1

CY8C5588LTI-114 数据手册

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PRELIMINARY  
PSoC® 5: CY8C55 Family Datasheet  
PSoC’s nonvolatile subsystem consists of flash, byte-writeable  
EEPROM, and nonvolatile configuration options. It provides up  
to 256 KB of on-chip flash. The CPU can reprogram individual  
blocks of flash, enabling boot loaders. The designer can enable  
an ECC for high reliability applications. A powerful and flexible  
protection model secures the user's sensitive information,  
allowing selective memory block locking for read and write  
protection. Two KB of byte-writable EEPROM is available  
on-chip to store application data. Additionally, selected  
configuration options such as boot speed and pin drive mode are  
stored in nonvolatile memory. This allows settings to activate  
immediately after POR.  
The CY8C55 family supports a wide supply operating range from  
1.71 to 5.5 V. This allows operation from regulated supplies such  
as 1.8 ± 5%, 2.5 V ±10%, 3.3 V ± 10%, or 5.0 V ± 10%, or directly  
from a wide range of battery types. In addition, it provides an  
integrated high efficiency synchronous boost converter that can  
power the device from supply voltages as low as 0.5 V. This  
enables the device to be powered directly from a single battery  
or solar cell. In addition, the designer can use the boost converter  
to generate other voltages required by the device, such as a  
3.3 V supply for LCD glass drive. The boost’s output is available  
on the VBOOST pin, allowing other devices in the application to  
be powered from the PSoC.  
The three types of PSoC I/O are extremely flexible. All I/Os have  
many drive modes that are set at POR. PSoC also provides up  
to four I/O voltage domains through the VDDIO pins. Every GPIO  
has analog I/O, LCD drive, flexible interrupt generation, slew rate  
control, and digital I/O capability. The SIOs on PSoC allow VOH  
to be set independently of VDDIO when used as outputs. When  
SIOs are in input mode they are high impedance. This is true  
even when the device is not powered or when the pin voltage  
goes above the supply voltage. This makes the SIO ideally suited  
for use on an I2C bus where the PSoC may not be powered when  
other devices on the bus are. The SIO pins also have high  
current sink capability for applications such as LED drives. The  
programmable input threshold feature of the SIO can be used to  
make the SIO function as a general purpose analog comparator.  
For devices with FS USB, the USB physical interface is also  
provided (USBIO). When not using USB, these pins may also be  
used for limited digital functionality and device programming. All  
the features of the PSoC I/Os are covered in detail in the “I/O  
System and Routing” section on page 25 of this datasheet.  
PSoC supports a wide range of low power modes. These include  
a 300-nA hibernate mode with RAM retention and a 2-µA sleep  
mode with RTC. In the second mode, the optional 32.768-kHz  
watch crystal runs continuously and maintains an accurate RTC.  
Power to all major functional blocks, including the programmable  
digital and analog peripherals, can be controlled independently  
by firmware. This allows low power background processing  
when some peripherals are not in use. This, in turn, provides a  
total device current of only 2 mA when the CPU is running at  
6 MHz.  
The details of the PSoC power modes are covered in the “Power  
System” section on page 20 of this datasheet.  
PSoC uses JTAG (4 wire) or SWD (2 wire) interfaces for  
programming, debug, and test. Using these standard interfaces  
enables the designer to debug or program the PSoC with a  
variety of hardware solutions from Cypress or third party  
vendors. The Cortex-M3 debug and trace modules include FPB,  
DWT, ETM, and ITM. These modules have many features to help  
solve difficult debug and trace problems. Details of the  
programming, test, and debugging interfaces are discussed in  
the “Programming, Debug Interfaces, Resources” section on  
page 50 of this datasheet.  
The PSoC device incorporates flexible internal clock generators,  
designed for high stability and factory trimmed for high accuracy.  
The Internal Main Oscillator (IMO) is the master clock base for  
the system, and has one-percent accuracy at 3 MHz. The IMO  
can be configured to run from 3 MHz up to 74 MHz. Multiple clock  
derivatives can be generated from the main clock frequency to  
meet application needs. The device provides a PLL to generate  
system clock frequencies up to 80 MHz from the IMO, external  
crystal, or external reference clock. It also contains a separate,  
very low-power ILO for the sleep and watchdog timers. A  
32.768-kHz external watch crystal is also supported for use in  
RTC applications. The clocks, together with programmable clock  
dividers, provide the flexibility to integrate most timing  
requirements.  
2. Pinouts  
The VDDIO pin that supplies a particular set of pins is indicated  
by the black lines drawn on the pinout diagrams in Figure 2-2 and  
Figure 2-3. Using the VDDIO pins, a single PSoC can support  
multiple interface voltage levels, eliminating the need for off-chip  
level shifters. Each VDDIO may sink up to 100 mA total to its  
associated I/O pins and opamps. On the 68-pin and 100-pin  
devices, each set of VDDIO associated pins may sink up to  
100 mA. The 48 pin device may sink up to 100 mA total for all  
Vddio0 plus Vddio2 associated I/O pins and 100 mA total for all  
Vddio1 plus Vddio3 associated I/O pins.  
Document Number: 001-44094 Rev. *J  
Page 5 of 102  
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