CY7C1380A
CY7C1382A
PRELIMINARY
512K x 36 / 1M x 18 Pipelined SRAM
inputs, address-pipelining Chip Enable (CE), burst control in-
puts (ADSC, ADSP, and ADV), write enables (BWa, BWb,
BWc, BWd and BWE), and Global Write (GW).
Features
• Fast clock speed: 167, 150, 133, 100 MHz
• Provide high-performance 3-1-1-1 access rate
• Fast OE access times: 3.4, 3.8, 4.2 and 5.0 ns
• Optimal for depth expansion
Asynchronous inputs include the Output Enable (OE) and
burst mode control (MODE). The data (DQ
) and the data
a,b,c,d
parity (DQP
nous.
) outputs, enabled by OE, are also asynchro-
a,b,c,d
• 3.3V (–5% / +10%) power supply
DQ
and DQP
apply to CY7C1380 and DQ and
• Common data inputs and data outputs
• Byte Write Enable and Global Write control
• Chip enable for address pipeline
a,b,c,d
a,b,c,d a,b
DQP apply to CY7C1382. a, b, c, d each are 8 bits wide in
the case of DQ and 1 bit wide in the case of DP.
a,b
Addresses and chip enables are registered with either Ad-
dress Status Processor (ADSP) or Address Status Controller
(ADSC) input pins. Subsequent burst addresses can be inter-
nally generated as controlled by the Burst Advance Pin (ADV).
• Address, data, and control registers
• Internally self-timed Write Cycle
• Burst control pins (interleaved or linear burst se-
quence)
• Automatic power-down for portable applications
• High-density, high-speed packages
Address, data inputs, and write controls are registered on-chip
to initiate self-timed WRITE cycle. WRITE cycles can be one
to four bytes wide as controlled by the write control inputs.
Individual byte write allows individual byte to be written. BWa
Functional Description
controls DQa and DQPa. BWb controls DQ and DQP . BWc
b
b
controls DQcand DQPd. BWd controls DQd-DQd and DQPd.
BWa, BWb, BWc, and BWd can be active only with BWE being
LOW. GW being LOW causes all bytes to be written. WRITE
pass-through capability allows written data available at the out-
put for the immediately next READ cycle. This device also in-
corporates pipelined enable circuit for easy depth expansion
without penalizing system performance.
The Cypress Synchronous Burst SRAM family employs
high-speed, low-power CMOS designs using advanced tri-
ple-layer polysilicon, double-layer metal technology. Each
memory cell consists of four transistors and two high-valued
resistors.
The CY7C1380A and CY7C1382A SRAMs integrate
524,288x36 and 1,048,576x18 SRAM cells with advanced
synchronous peripheral circuitry and a 2-bit counter for inter-
nal burst operation. All synchronous inputs are gated by reg-
isters controlled by a positive-edge-triggered Clock Input
(CLK). The synchronous inputs include all addresses, all data
All inputs and outputs of the CY7C1380A and the CY7C1382A
are JEDEC standard JESD8-5 compatible.
Selection Guide
167 MHz
150 MHz
3.8
133 MHz
4.2
100 MHz
5.0
Maximum Access Time (ns)
3.4
350
30
Maximum Operating Current (mA)
Commercial
310
280
250
Maximum CMOS Standby Current (mA)
30
30
30
Shaded areas contain advance information.
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
May 18, 2000