5秒后页面跳转
CY62128DV30 PDF预览

CY62128DV30

更新时间: 2024-02-23 17:24:11
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
11页 198K
描述
1 Mb (128K x 8) Static RAM

CY62128DV30 数据手册

 浏览型号CY62128DV30的Datasheet PDF文件第2页浏览型号CY62128DV30的Datasheet PDF文件第3页浏览型号CY62128DV30的Datasheet PDF文件第4页浏览型号CY62128DV30的Datasheet PDF文件第5页浏览型号CY62128DV30的Datasheet PDF文件第6页浏览型号CY62128DV30的Datasheet PDF文件第7页 
CY62128DV30  
MoBL  
1 Mb (128K x 8) Static RAM  
power consumption by 90% when addresses are not toggling.  
The device can be put into standby mode reducing power con-  
sumption by more than 99% when deselected Chip Enable 1  
(CE1) HIGH or Chip Enable 2 (CE2) LOW. The input/output  
pins (I/O0 through I/O7) are placed in a high-impedance state  
when: deselected Chip Enable 1 (CE1) HIGH or Chip Enable  
2 (CE2) LOW, outputs are disabled (OE HIGH), or during a  
write operation (Chip Enable 1 (CE1) LOW and Chip Enable 2  
(CE2) HIGH and Write Enable (WE) LOW).  
Features  
• Very high speed: 55 and 70 ns  
• Wide voltage range: 2.2V to 3.6V  
• Pin compatible with CY62128V  
• Ultra-low active power  
— Typical active current: 0.85 mA @ f = 1 MHz  
— Typical active current: 5 mA @ f = fMAX  
• Ultra-low standby power  
Writing to the device is accomplished by taking Chip Enable 1  
(CE1) LOW with Chip Enable 2 (CE2) HIGH and Write En-  
able(WE) LOW. Data on the eight I/O pins is then written into  
the location specified on the Address pin (A0 thro. A16).  
• Easy memory expansion with CE1, CE2, and OE  
features  
• Automatic power-down when deselected  
• Packages offered in a 32-lead SOIC, a 32-lead TSOP, a  
32-lead Short TSOP, and a 32-lead Reverse TSOP  
Reading from the device is accomplished by taking Chip En-  
able 1 (CE1) LOW with Chip Enable 2 (CE2) HIGH and Output  
Enable (OE) LOW while forcing the Write Enable (WE) HIGH.  
Under these conditions, the contents of the memory location  
specified by the address pins will appear on the I/O pins.  
Functional Description[1]  
The CY62128DV30 is a high-performance CMOS static RAM  
organized as 128K words by 8 bits. This device features ad-  
vanced circuit design to provide ultra-low active current. This  
is ideal for providing More Battery Life(MoBL®) in portable  
applications such as cellular telephones. The device also has  
an automatic power-down feature that significantly reduces  
The eight input/output pins (I/Oo through I/O7) are placed in a  
high-impedance state when the device is deselected (CE1  
HIGH or CE2 LOW), the outputs are disabled (OE HIGH) or  
during a write operation (CE1 LOW, CE2 HIGH), and WE  
LOW).  
Logic Block Diagram  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
0
1
2
3
4
5
6
Data in Drivers  
A
A
A
A
A
A
0
1
2
3
4
5
6
7
A
128K x 8  
ARRAY  
A
A
A
A10  
A11  
8
9
Power-  
down  
CE  
CE  
COLUMN  
DECODER  
1
2
I/O  
WE  
OE  
7
Note:  
1. For best-practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.  
Cypress Semiconductor Corporation  
Document #: 38-05231 Rev. *C  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Revised August 29, 2003  

与CY62128DV30相关器件

型号 品牌 获取价格 描述 数据表
CY62128DV30_06 CYPRESS

获取价格

1-Mb (128K x 8) Static RAM
CY62128DV30L-55SI ROCHESTER

获取价格

128KX8 STANDARD SRAM, 55ns, PDSO32, 0.450 INCH, SOIC-32
CY62128DV30L-55SI CYPRESS

获取价格

1 Mb (128K x 8) Static RAM
CY62128DV30L-55ZAI CYPRESS

获取价格

1 Mb (128K x 8) Static RAM
CY62128DV30L-55ZI CYPRESS

获取价格

1 Mb (128K x 8) Static RAM
CY62128DV30L-55ZI ROCHESTER

获取价格

128KX8 STANDARD SRAM, 55ns, PDSO32, 8 X 20 MM, TSOP1-32
CY62128DV30L-55ZIT CYPRESS

获取价格

Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32
CY62128DV30L-55ZRI CYPRESS

获取价格

1 Mb (128K x 8) Static RAM
CY62128DV30L-55ZRI ROCHESTER

获取价格

128KX8 STANDARD SRAM, 55ns, PDSO32, REVERSE, TSOP1-32
CY62128DV30L-55ZRIT CYPRESS

获取价格

Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, REVERSE, TSOP1-32