是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, TFBGA-484 |
针数: | 484 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.91 |
其他特性: | YES | 系统内可编程: | YES |
JESD-30 代码: | S-PBGA-B484 | JESD-609代码: | e0 |
JTAG BST: | YES | 长度: | 23 mm |
湿度敏感等级: | 3 | 专用输入次数: | |
I/O 线路数量: | 218 | 宏单元数: | 768 |
端子数量: | 484 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 0 DEDICATED INPUTS, 218 I/O |
输出函数: | MACROCELL | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LBGA | 封装等效代码: | BGA484,22X22,40 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, LOW PROFILE |
峰值回流温度(摄氏度): | 220 | 电源: | 1.5/3.3,1.8 V |
可编程逻辑类型: | LOADABLE PLD | 传播延迟: | 10 ns |
认证状态: | Not Qualified | 座面最大高度: | 1.6 mm |
子类别: | Programmable Logic Devices | 最大供电电压: | 1.95 V |
最小供电电压: | 1.65 V | 标称供电电压: | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | TIN LEAD |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 23 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CY39050Z484-222MBC | CYPRESS |
获取价格 |
Loadable PLD, 7ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, TFBGA-484 | |
CY39050Z484-233MBC | CYPRESS |
获取价格 |
Loadable PLD, 7.2ns, 768-Cell, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, TFBG | |
CY39050Z484-83MBC | CYPRESS |
获取价格 |
Loadable PLD, 15ns, 768-Cell, CMOS, PBGA484, 23 X 23 MM, 1.6 MM HEIGHT, 1 MM PITCH, FBGA-4 | |
CY39050Z484-83MBI | CYPRESS |
获取价格 |
Loadable PLD, 15ns, 768-Cell, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, TFBGA | |
CY39050Z676-125BBC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39050Z676-125BBI | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39050Z676-125BGC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39050Z676-125BGI | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39100V208-125BBC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39100V208-125BBI | CYPRESS |
获取价格 |
CPLDs at FPGA Densities |