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CXXXEZ1000-SXX000 PDF预览

CXXXEZ1000-SXX000

更新时间: 2024-09-26 03:14:35
品牌 Logo 应用领域
科锐 - CREE /
页数 文件大小 规格书
6页 306K
描述
Cree㈢ EZ1000⑩ LEDs

CXXXEZ1000-SXX000 数据手册

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Cree® EZꢀ000™ LEDs  
Data Sheet  
CxxxEZꢀ000-Sxx000  
Cree’s EZBright™ LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN  
materials with Cree’s proprietary optical design and device submount technology to deliver superior value for high-  
intensity LEDs. The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern.  
Additionally, these LEDs are die-attachable with conductive epoxy, solder paste or solder preforms, as well as the flux  
eutectic method. These vertically structured, low forward voltage LED chips are approximately 100 microns in height.  
Cree’s EZ™ chips are tested for conformity to optical and electrical specifications. These LEDs are useful in a broad  
range of applications such as general illumination, automotive lighting, and LCD backlighting.  
FEATURES  
APPLICATIONS  
EZBright LED Technology  
General Illumination  
200 mW min. - 450, 460 & 470 nm  
300 mW min. - 450, 460 & 470 nm  
80 mW min. - 527 nm  
Aircraft  
Decorative Lighting  
Task Lighting  
130 mW min. - 527 nm  
Outdoor Illumination  
Lambertian Radiation  
White LEDs  
Conductive Epoxy, Solder Paste or Preforms, or Flux  
Eutectic Attach  
LCD Backlighting  
Projection Displays  
Automotive  
Thin 100 μm Chip  
Low Forward Voltage  
CxxxEZꢀ000-Sxx000 Chip Diagram  
Die Cross Section  
Bottom View  
Top View  
EZBright LED  
980 x 980 μm2  
Cathodes (-)  
130 x 130 μm2  
t = 100 μm  
Anode (+)  
3 μm AuSn  
Gold Bond Pads (2)  
Backside Metalization  
Subject to change without notice.  
www.cree.com  

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