Datasheet > CT201003APO

CT201003APO

更新时间： 2022-12-21 11:53:54

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Chip Resistors - Tin / Gold Terminations Available

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CT201003APO 数据手册

THIN FILM PRECISION CHIP RESISTORS

The content of this specification may change without notification 10/12/07

CT Series Chip Resistors – Tin / Gold Terminations Available

Custom solutions are available.

HOW TO ORDER

CT G 10 1003

B X M

Packaging

M = Std. Reel

O = 1K Reel

TCR (PPM/°C)

L = +1

M = +2

N = +3

P = +5

Q = +10

X = +25

Y = +50

Z = +100

FEATURES

Nichrome Thin Film Resistor Element

Tolerance (%)

U=+.01

P=+.02

A=+.05

B=+.10

C=+.25

D=+.50

F=+1

CTG type constructed with top side terminations,

wire bonded pads, and Au termination material.

EIA Resistance Value

Standard decade values

Anti-Leaching Nickel Barrier Terminations

Very Tight Tolerances, as low as ±0.02%

Extremely Low TCR, as low as ±1ppm

Special Sizes available 1217, 2020, and 2045

Size

20 = 0201

05 = 0402

16 = 0603

10 = 0805

18 = 1206

14 = 1210

13 = 1217

12 = 2010

11 = 2020

09 = 2045

01 = 2512

Either ISO 9001 or ISO/TS 16949:2002

Certified

Termination Material

Sn = Leave Blank

Applicable Specifications: EIA575, IEC 60115-1,

Au = G

JIS C5201-1, CECC 40401, MIL-R-55342D

Series

CT = Thin Film Precision Resistors

SCHEMATIC

DIMENSIONS (mm)

Wraparound Termination

Size

0201

0.60 + 0.05

0.30 + 0.05

0.5+0.1^-0.05

0.80 + 0.10

1.25 + 0.15

1.60 + 0.15

2.60 + 0.15

4.20 + 0.20

2.60 + 0.15

5.08 + 0.20

11.5+ 0.30

3.10 + 0.15

0.13 + 0.05

0.20 + 0.10

0.40 + 0.25

0.45 + 0.25

0.50 + 0.30

0.80 + 0.30

0.50 + 0.30

0.80 + 0.30

0.60 + 0.25

0.25+0.05

0.25 + 0.05

0.35 + 0.05

0.50 + 0.10

0.50 + 0.15

0.60 + 0.15

0.60 + 0.10

0.9 max

0402

0603

0805

1206

1210

1217

2010

2020

2045

2512

1.00 + 0.05

1.60 + 0.10

2.00 + 0.15

3.20 + 0.15

3.00 + 0.20

5.00 + 0.15

5.08 + 0.20

5.00 + 0.15

6.30 + 0.15

0.25+0.05^-0.10

0.30+0.20^-0.10

0.40+0.20^-0.10

0.80 + 0.25

0.40+0.20^-0.10

0.80 + 0.30

0.50 + 0.25

0.70 + 0.10

0.9 max

Top Side Termination, Bottom Isolated – CTG Type

0.9 max

0.60 + 0.10

Wire Bond Pads

Terminal Material: Au

CONSTRUCTION FIGURE (Wraparound)

CONSTRUCTION MATERIALS

Item

Part

Material

Resistor

Nichrome Thin Film

Polymide Epoxy Resin

Protective Film

Electrode

Grounding Layer

Electrode Layer

Barrier Layer

Solder Layer

Substrate

Nichrome Thin Film

Copper Thin Film

Nickel Plating

Solder Plating (Sn)

Alumina

Marking

Epoxy Resin

r &

The resistance value is on the front side

The production month is on the backside

188 Technology Drive, Unit H, Irvine, CA 92618

TEL: 949-453-9888 FAX: 949-453-8889

American Accurate Components, Inc.

12 3

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