Silicon N-Channel Power MOSFET
CS300N04 AR
R
○
General Description:
VDSS
ID(
40
300
120
271.7
1.6
V
CS300N04 AR, the silicon N-channel Enhanced
VDMOSFETs, is obtained by the high density Trench
technology which reduce the conduction loss, improve switching
performance and enhance the avalanche energy. This device is
suitable for use as a load switch and PWM applications. The
package form is TO-262, which accords with the RoHS standard.
Features:
A
A
Silicon limited current)
ID(
Package limited)
PD
W
RDS(ON)Typ
mΩ
l Fast Switching
l Low ON Resistance(Rdson≤2.0 mΩ)
l Low Gate Charge
l Low Reverse transfer capacitances
l 100% Single Pulse avalanche energy Test
Applications:
l BLDC Motor drive applications
l
l
l
Half-bridge and full-bridge topologies
Synchronous rectifier applications
DC/DC and AC/DC converters
Absolute(Tj= 25℃ unless otherwise specified)
Parameter
Symbol
VDSS
Rating
Units
Drain-to-Source Voltage
Continuous Drain Current TC = 25 °C
40
V
A
300
(Silicon limited current)
a1
Continuous Drain Current TC = 25 °C(Package limited)
ID
120
A
a1
Continuous Drain Current TC = 100 °C(Package limited)
Pulsed Drain Current TC = 25 °C
Gate-to-Source Voltage
120
A
a1
480
A
IDM
VGS
±20
800
V
a2
Avalanche Energy
mJ
W
EAS
Power Dissipation TC = 25 °C
271.7
PD
Derating Factor above 25°C
2.17
W/℃
℃
℃
Operating Junction and Storage Temperature Range
MaximumTemperature for Soldering
TJ,Tstg
150,–55 to 150
300
TL
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2020V01