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CP304 PDF预览

CP304

更新时间: 2024-09-26 09:30:07
品牌 Logo 应用领域
CENTRAL 晶体晶体管
页数 文件大小 规格书
2页 472K
描述
Small Signal Transistor NPN - High Current Transistor Chip

CP304 数据手册

 浏览型号CP304的Datasheet PDF文件第2页 
PROCESS CP304  
Small Signal Transistor  
NPN - High Current Transistor Chip  
PROCESS DETAILS  
Process  
EPITAXIAL PLANAR  
Die Size  
22 x 22 MILS  
9.0 MILS  
Die Thickness  
Base Bonding Pad Area  
Emitter Bonding Pad Area  
Top Side Metalization  
Back Side Metalization  
5.7 x 3.9 MILS  
5.3 x 3.9 MILS  
Al - 30,000Å  
Au - 18,000Å  
GEOMETRY  
GROSS DIE PER 4 INCH WAFER  
22,400  
PRINCIPAL DEVICE TYPES  
MPSA05  
MPSA06  
R4 (22-March 2010)  
www.centralsemi.com  

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